RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO 45001
IECQ 080000

Silicone・TIMs

Silicon-based thermal interface materials feature ultra-high thermal conductivity, providing effective heat dissipation enhancement and enabling equipment to maintain high-performance operation for extended periods. They typically use silicone oil or silicone elastomers as the base material, mixed with metal oxides or other high thermal conductivity fillers. Thermal pads are suitable for gap-filling thermal conduction applications with multiple heat sources, commonly used in automotive electronics, 5G base stations, and aerospace fields.

3.0 W/m·K
Fiberglass reinforced
2.5 W/m·K
TO220 / TO3P
2.5 W/m·K
Fiberglass reinforced
2.2 W/m·K
Tensile strength 0.75 MPa
2.2 W/m·K
Fast Curing in room temperature
2.0 W/m·K
Fiberglass reinforced
2.0 W/m·K
Thermal & Absorber
1.8 W/m·K
Heat Resistant to 180°C
1.2 W/m·K
Heat Resistant to 180°C
8.0 W/m·K
High Thermal Conductive
13.0 W/m·K
High Thermal Conductive
18.0 W/m·K
High Thermal Conductive
24.0 W/m·K
High Thermal Conductive
11.0 W/m·K
High Thermal Conductive
15.0 W/m·K
High Thermal Conductive
20.0 W/m·K
High Thermal Conductive
2.0 W/m·K
Thermal & Absorber
3.0 W/m·K
Thermal & Absorber
4.0 W/m·K
Thermal & Absorber

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Product News | N700C, N800A-s, N800B, and N800C Non-Silicone Thermal Pads Comply with ASTM E595 Test Requirements. For detailed specifications, please refer to the product datasheets.