Solid series

Thermal pads require no application process, avoiding potential issues such as uneven application, thickness control difficulties, and peripheral contamination that may occur when using thermal paste.

Thermal pads are pre-formed solid thermal interface materials that function by filling microscopic gaps formed due to surface roughness between heat-generating components and heat sinks, replacing air with extremely low thermal conductivity (only 0.024W/m·K), thereby significantly reducing contact thermal resistance and enhancing overall heat dissipation efficiency. Compared to traditional thermal paste, thermal pads offer distinct operational convenience advantages.