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DTT55-s Two-Part Thermal Conductive Die Attach Adhesive
CATEGORY
FEATURES
/ 5.0 W/m·K thermal conductivity for effective AI chip junction temperature reduction
/ Liquid gap-filling material that becomes heat-cured for long-term resistance to fluid flow and thermal cycling in high-load EV applications
/ Heat-cured for high structural stability under long-term fluid flow and thermal cycling
/ Compatible with immersion cooling, with no dissolution, swelling, or contaminant leaching
/ High reliability with stable thermal performance under long-term high-temperature operation
CONFIGURATIONS
/ Cartridges: 50ml, 400ml
/ Other special and custom sizes are available upon request
TYPICAL APPLICATION
/ AI GPU Modules (NVIDIA, AMD, and proprietary ASICs)
/ AI Servers with Immersion Cooling
/ High-Power Accelerator Cards, including OAM, HGX, and custom-designed modules
/ Liquid Cooling / Immersion Hybrid Thermal Architecture
/ High-Performance Computing (HPC) Systems
/ Industrial Servers / Industrial Control Computing Platforms
/ Power Modules / Power Electronics Cooling
/ Telecommunications / 5G High-Density Computing Modules
/ EV / New Energy High-Power Electronic Modules
TYPICAL PROPERTIES
| Property | DTT55-s | UNIT | TEST METHOD |
|---|---|---|---|
| Color | White (A part) Gray (B part) |
– | Visual |
| Solid content | 100% (Two-part：100:100) |
– | – |
| Viscosity A | 85 | Pa.s | ISO 3219 |
| Viscosity B | 85 | Pa.s | ISO 3219 |
| Density | 2.7 | g/cm³ | ASTM D792 |
| Lap shear to aluminum | 10 | N/cm² | ASTM D1002 |
| Shelf Life | 24 months | – | – |
| RoHS & REACH | Compliant | – | – |
| SOLID(AFTER CURE) | |||
| Thermal conductivity | 5.0 | W/m·K | ASTM D5470 |
| Bond line thickness | 30 | μm | – |
| Hardness | 25 | Shore A | ASTM D2240 |
| Volume resistivity | >1012 | Ohm-m | ASTM D257 |
| Dielectric breakdown | 14 | KV/mm | ASTM D149 |
| Long-term operating temperature | -60～200 | °C | – |
| Operating ambient temp | 20～30 | °C | – |
| Curing conditions | |||
| Pot life @ 25°C | 60 | min | Internal Test Method |
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