Stable thermal performance at elevated temperatures.

Silicone
Non-Silicone

Silicone

DTT56-s Two-Part Thermal Conductive Die Attach Adhesive

6.0 W/m·K

Stable thermal performance at elevated temperatures.

DTT55-s Two-Part Thermal Conductive Die Attach Adhesive

5.0 W/m·K

Stable thermal performance at elevated temperatures.

DTT54-s Two-Part Thermal Conductive Die Attach Adhesive

4.0 W/m·K

Stable thermal performance at elevated temperatures.

Non-Silicone

DTT56-s Two-Part Thermal Conductive Die Attach Adhesive

6.0 W/m·K

Stable thermal performance at elevated temperatures.

DTT55-s Two-Part Thermal Conductive Die Attach Adhesive

5.0 W/m·K

Stable thermal performance at elevated temperatures.

DTT54-s Two-Part Thermal Conductive Die Attach Adhesive

4.0 W/m·K

Stable thermal performance at elevated temperatures.

Product News | N700C, N800A-s, N800B, and N800C Non-Silicone Thermal Pads Comply with ASTM E595 Test Requirements. For detailed specifications, please refer to the product datasheets.