Stable thermal performance at elevated temperatures.

Silicone
Non-Silicone

Silicone

DTT56-s Two-Part Thermal Conductive Die Attach Adhesive

6.0 W/m·K

Stable thermal performance at elevated temperatures.

DTT55-s Two-Part Thermal Conductive Die Attach Adhesive

5.0 W/m·K

Stable thermal performance at elevated temperatures.

DTT54-s Two-Part Thermal Conductive Die Attach Adhesive

4.0 W/m·K

Stable thermal performance at elevated temperatures.

Non-Silicone

DTT56-s Two-Part Thermal Conductive Die Attach Adhesive

6.0 W/m·K

Stable thermal performance at elevated temperatures.

DTT55-s Two-Part Thermal Conductive Die Attach Adhesive

5.0 W/m·K

Stable thermal performance at elevated temperatures.

DTT54-s Two-Part Thermal Conductive Die Attach Adhesive

4.0 W/m·K

Stable thermal performance at elevated temperatures.

News | N-putty5, N700C & N800 Series non-silicone thermal materials meet ASTM E595 requirements. See datasheets.