Liquid
Solid
Absorber
Tape
Light
Insulator
Graphite
Break
New, Silicone・TIMs ——
/ Thermal conductivity: 24.0 W/m*K
/ High compression rate
/ Extremely low thermal impedance
// Sheets form
// Die-cuts parts
/ Between CPU and heat sink
/ Between a component and heat sink
/ Flat-panel displays
/ Power supplies
/ High speed mass storage drives
/ Telecommunication hardware
/ 5G base station & infrastructure
/ High-end Chip
PROPERTY | T-top99-s | UNIT | TEST METHOD |
---|---|---|---|
Color | Gray | - | Visual |
Surface tack 2-side/1-side | 2 | - | - |
Thickness | Customized | mm | ASTM D374 |
Density | 3.3 | g/cm³ | ASTM D792 |
Hardness | 70 | Shore OOO | ASTM D2240 |
TML | <0.1 | % | By LiPOLY |
Application temperature | -60~150 | °C | - |
ROHS & REACH | Compliant | - | - |
THERMAL | |||
Thermal Conductivity | 24.0 | W/m*K | ASTM D5470 |
Thermal Conductivity | 15.0 | W/m*K | ISO 22007-2 |
Thermal Impedance@10psi | 0.085 | °C-in²/ W | ASTM D5470 |