RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000
T-top99-s
24.0 W/m*K
Extreme Series
T-top99-s Extreme Thermal Pad is an ultra-high thermal conductivity pad with a thermal conductivity of 24.0 W/m*K. It features excellent electrical insulation, compressibility, and flexibility characteristics, specifically designed for uneven surface applications, capable of filling micro gaps and reducing contact thermal resistance.

CATEGORY

FEATURES

/ Thermal conductivity: 24.0 W/m*K
/ High compression rate
/ Extremely low thermal impedance

SPECIFICATIONS

// Sheets form
// Die-cuts parts

TYPICAL APPLICATION

/ Between CPU and heat sink
/ Between a component and heat sink
/ Flat-panel displays
/ Power supplies
/ High speed mass storage drives
/ Telecommunication hardware
/ 5G base station & infrastructure
/ High-end Chip

Thermal Resistance vs. Pressure vs. Deflection

TYPICAL PROPERTIES

PROPERTY T-top99-s UNIT TEST METHOD
Color Gray - Visual
Surface tack 2-side/1-side 2 - -
Thickness Customized mm ASTM D374
Density 3.3 g/cm³ ASTM D792
Hardness 70 Shore OOO ASTM D2240
TML <0.1 % By LiPOLY
Application temperature -60~150 °C -
ROHS & REACH Compliant - -
THERMAL
Thermal Conductivity 24.0 W/m*K ASTM D5470
Thermal Conductivity 15.0 W/m*K ISO 22007-2
Thermal Impedance@10psi 0.085 °C-in²/ W ASTM D5470

Related​ Product

T-top99-s
24.0 W/m*K
Extreme Series

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    LiPOLY® Advance TIMs

    桃園市八德區永豐路435號

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