RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000

Silicone・TIMs

Silicon-based thermal interface materials feature ultra-high thermal conductivity, providing effective heat dissipation enhancement and enabling equipment to maintain high-performance operation for extended periods. They typically use silicone oil or silicone elastomers as the base material, mixed with metal oxides or other high thermal conductivity fillers. Thermal pads are suitable for gap-filling thermal conduction applications with multiple heat sources, commonly used in automotive electronics, 5G base stations, and aerospace fields.

Ti900-s

1.5 W/m·K
Ultra-thin Absorber

TPS32

1.5 W/m·K
Encapsulants

SH1500

1.5 W/m·K
Fiberglass reinforced

G3380A

1.3 W/m·K
Low minimum bond line

ST6000F

1.2 W/m·K
耐高温180℃

TPS589

0.8 W/m·K
Encapsulants

SP-23

0.8 W/m·K
TO220 / TO3P

TP200

0.8 W/m·K
TO220 / TO3P

TPS31

0.55 W/m·K
Encapsulants

TEM96E

6.0 W/m·K
Thermal & Absorber

Ti900-s

1.5 W/m·K
Ultra-thin Absorber

TP200

0.8 W/m·K
TO220 / TO3P

TPS31

0.55 W/m·K
Encapsulants

TPS32

1.5 W/m·K
Encapsulants

TPS586

1.5 W/m·K
Encapsulants

TPS5868

3.0 W/m·K
Encapsulants

TPS589

0.8 W/m·K
Encapsulants

TT3000

6.0 W/m·K
Nano Thermal Grease

For all informaton you need

CALL US: 03-3788588

Thermal Solutions Expert

LiPOLY® Advance TIMs

Taoyuan City, Bade District, Yongfeng Road, No. 435

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N800C Non-Silicone Thermal Pad – Compliant with ASTM E595 Low Outgassing Standards

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