Show Highlights and Industry Trends: The Dual Thermal and EMI Challenges of High-Density Semiconductors
With the rapid adoption of 5G/6G communications, artificial intelligence (AI) computing chips, automotive electronics, and high-performance computing (HPC) systems, electronic equipment and semiconductor packaging are advancing toward extreme density and miniaturization. However, high-frequency operation and sharply rising power consumption have created two core challenges that affect system stability: thermal overheating and high-frequency electromagnetic interference (EMI noise).
Within enclosed and confined mechanical spaces, conventional single-function thermal pads or EMI shielding materials can no longer meet the demands of modern high-specification designs. Engineers urgently need multifunctional interface materials that both conduct heat and absorb electromagnetic waves, as well as advanced siloxane-free materials that prevent electrical contact failures caused by low-molecular-weight siloxane volatilization. In response to this critical industry need, LiPOLY (Shiu Li Technology) will present a complete range of advanced solutions for simultaneous thermal and electromagnetic noise management at NEPCON Japan 2026.
Core Products on Display
LiPOLY has selected three core products specifically developed to address the challenges of high-frequency, high-power semiconductor designs for display at Booth A6-7:
Non-Silicone, High-Thermal-Conductivity RF Absorber Pad: NT94
- Technical Features：NT94 is a highly thermally conductive electromagnetic wave absorbing pad based on a non-silicone resin. With no low-molecular-weight siloxane volatilization, it eliminates at the source the risk of silicone oil bleed contaminating optical components or causing electrical contact failures, making it highly suitable for precision optical modules, hard disk drives (HDDs), and highly sensitive semiconductor equipment.
- Performance Data：Thermal conductivity reaches 4.0 W/m·K; high-frequency absorption performance reaches 118 dB/cm at 28 GHz and 49 dB/cm at 39 GHz. With a hardness of Shore OO 65, it offers excellent self-adhesion and reworkability.
Highly Conformable Thermally Conductive RF Absorber Putty: DTT18-s
- Technical Features：DTT18-s is a one-part thermally conductive RF absorber putty. It provides excellent flowability and tolerance compensation, perfectly filling microscopic air gaps and irregular mechanical surfaces while applying extremely low stress to sensitive chips and PCB assemblies during assembly, effectively preventing board deformation and solder-joint cracking.
- Performance Data：It has a thermal conductivity of 1.8 W/m·K, supports automated dispensing with sag resistance, overcomes the overflow and drying issues of conventional thermal grease, and provides wave absorption across 10MHz ~ 77GHz.
Premium Thermally Conductive RF Absorber Pad: TEM96E
- Technical Features：TEM96E is a premium silicone-based thermally conductive RF absorber pad designed for extreme heat dissipation and demanding EMI suppression requirements. Soft magnetic metal powder is uniformly dispersed in a polymer resin, enabling high-frequency electromagnetic wave energy to be rapidly converted into heat and dissipated while preventing repeated reflections within metal shielding cavities.
- Performance Data：Thermal conductivity reaches 6.0 W/m·K; wave absorption attenuation reaches 94.2 dB/cm at 12 GHz and 88.4 dB/cm at 28 GHz, making it the preferred material for 5G millimeter-wave base stations, AI GPU server modules, and low Earth orbit (LEO) satellite ground stations.
Business Benefits of Choosing Our Solutions
- Dual Optimization of Space and Cost：Integrating thermal conduction and wave absorption into a single material significantly saves PCB layout space, reduces assembly steps, and lowers overall component costs.
- Improved High-Frequency System Stability and Reliability：Efficiently absorbs high-frequency noise from 10MHz to 77GHz while substantially lowering chip operating temperatures, helping ensure that 5G, AI, and automotive systems operate continuously without throttling or crashes.
- Zero Silicone Contamination Assurance：Non-silicone products such as NT94 completely resolve contamination caused by silicone oil volatilization and comply with stringent international environmental and quality certifications.
- Customization and Automated Process Support：Available in rolls, sheets, die-cut parts, and liquid dispensing formats to perfectly match customers’ high-volume production requirements.
NEPCON Japan 2026 Exhibition and Meeting Information
We sincerely invite electronic equipment and semiconductor design and development professionals to visit the LiPOLY booth, where our engineering team will provide one-on-one consultation on thermal and electromagnetic noise challenges, along with sample testing services.
Exhibition Information
- Exhibition：NEPCON Japan 2026
- Dates：September 9 (Wed)–11 (Fri), 2026
- time: 10:00－17:00
- Venue: Makuhari Messe, Japan
- Booth：Hall 1, Booth A6-7
- Event Details： NEPCON Japan 2026
