FEATURES
/ 6.0 W/m·K thermal conductivity for effective AI chip junction temperature reduction
/ Liquid gap-filling material that becomes heat-cured for long-term resistance to fluid flow and thermal cycling in high-load EV applications
/ Heat-cured for high structural stability under long-term fluid flow and thermal cycling
/ Compatible with immersion cooling, with no dissolution, swelling, or contaminant leaching
/ High reliability with stable thermal performance under long-term high-temperature operation
CONFIGURATIONS
/ Cartridges: 50ml, 400ml
/ Other special and custom sizes are available upon request
