NEW
Fiberglass cloth reinforced AS50-s
Thermal conductivity：
5.0 W/m·K
The fiberglass Cloth reinforced Thermal Pads use glass fiber cloth filled with thermally conductive compounds, combining strength and heat conduction for electronics heat transfer and insulation.
Thermal Resistance vs. Pressure vs. Deflection
FEATURES
- Thermal Conductivity：5.0 W/m·K
- DFM 可製造性設計
- 具備高介電擊穿強度
- 兼具吸收衝擊與減震功能
- 具備良好機械強度
- 玻璃纖維強化結構
CONFIGURATIONS
- Roll form
- Sheets form
- Die-cuts parts
TYPICAL APPLICATION
- Between a component and heat sink
- Flat-panel displays
- LED、硬碟、光碟機
- 熱導管散熱模組
- Memory modules
- Power supplies
- 5G base station & infrastructure
- EV electric vehicle
Specifications
| PROPERTY | Fiberglass cloth reinforced AS50-s | UNIT | TEST METHOD |
|---|---|---|---|
| Color | Gray | - | Visual |
| Surface tack 2-side/1-side | 1 | - | - |
| Reinforced layer | Fiberglass | - | - |
| Thickness | Customized | mm | ASTM D374 |
| Density | 3.1 | g/cm³ | ASTM D792 |
| Hardness | 25 | Shore OO | ASTM D2240 |
| Application temperature | -60~180 | °C | - |
| ROHS & REACH | Compliant | ||
| THERMAL | |||
| Thermal conductivity | 5.0 | W/m*K | ASTM D5470 |
| Thermal impedance@10 psi | 0.398 | °C-in²/ W | ASTM D5470 |
| Thermal impedance@50 psi | 0.287 | °C-in²/ W | ASTM D5470 |