NEW
Non-Silicone
PCM900 Phase Change Material
Thermal conductivity：
9.0 W/m·K
LiPOLY PCM900 is a high-performance Phase Change Material that remains solid at room temperature for easy handling and automated assembly. At approximately 45°C, it softens and conforms to microscopic gaps between the heat source and heat sink, effectively reducing thermal resistance and improving heat transfer efficiency. Formulated with advanced thermally conductive fillers and a reliable phase change matrix, PCM900 resists pump-out and dry-out, providing excellent long-term reliability while delivering thermal performance comparable to premium thermal greases. It offers a stable, efficient, and reliable thermal interface solution.
Thermal Impedance vs Pressure
FEATURES
- / Thermal conductivity: 9.0 W/m·K , 45°C phase change, low thermal resistance
- / Min. BLT 24 μm, good wettability, gap filling
- / High reliability, pump-out resistant
- / Room-temp application, no dispensing required
- / Electrical insulation, high-power applications
CONFIGURATIONS
- Roll form / Sheet form
- Die-cuts parts
TYPICAL APPLICATION
- AI / HPC: AI servers, GPUs
- Data Center：Server、Network
- Consumer：PC、SSD、Game Console
- Power：Power Module、Power Supply
- Automotive：ECU、BMS、OBC
Specifications
| PROPERTY | PCM900 Phase Change Material | UNIT | TEST METHOD |
|---|---|---|---|
| Color | White (A part) Gray (B part) | - | Visual |
| A:B | 100:100 | - | - |
| Viscosity A | 273 | Pa.s | ISO 3219 |
| Viscosity B | 273 | Pa.s | ISO 3219 |
| Density | 3.3 | g/cm³ | ASTM D792 |
| Shelf Life | 24 months | - | - |
| Hardness (AFTER CURE) | 25 | Shore A | ASTM D2240 |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 6.0 | W/m*K | ASTM D5470 |
| Thermal impedance@2mils BLT | - | °C-in²/ W | ASTM D5470 |
| Working temp (long term) | -60 ~ 200 | °C | - |