Shiu Li Technology (LiPOLY) will participate in the Techno Frontier 2026, Japan's iconic electronics and electromechanical technology event, from July 15 to 17, 2026. We will showcase our cutting-edge thermal management material technologies at the West Hall of Tokyo Big Sight.
We sincerely invite partners from electronic components, telecommunications, industrial control, automotive electronics, green energy systems, and advanced manufacturing industries to visit our booth for technical exchange and explore next-generation thermal management solutions together.
Exhibition Information
- Date | July 15, 2026 (Wednesday) – July 17, 2026 (Friday)
- Time | 09:30 – 17:00
- Venue | Tokyo Big Sight, West Hall
- Booth Number | 3-A16
- Event Details | Techno Frontier 2026
From Thermal Conductivity to Thermal Insulation: Building a Comprehensive Thermal Management Solution
As electronic devices continue to develop towards high performance, miniaturization, and high power density, effectively controlling heat flow has become a key factor in product reliability and safety.
At this exhibition, LiPOLY will showcase two iconic thermal management materials that address the two major design requirements: "thermal conductivity" and "thermal insulation."
T-top99-s High Thermal Conductive Gap Filler
An extremely high-performance thermally conductive pad with an ultra-high thermal conductivity of 24 W/m*K, combining high thermal performance, excellent insulation, and compressibility.
It can effectively fill gaps between heat-generating components and heat sinks, exhibit a very low thermal resistance effect, and ensure an efficient and consistent transfer of heat to the cooling system, thereby improving overall heat dissipation performance.
As high-power electronic devices continue to advance, T-top99-s provides design engineers with a more efficient choice for thermal management.
FEATURES
- Thermal conductivity: 24.0 W/m*K
- High compression rate
- Extremely low thermal impedance
- Excellent insulator
TYPICAL APPLICATION
- Between CPU and heat sink
- Between a component and heat sink
- High-end Chip
- Power supplies
- High speed mass storage drives
- Telecommunication hardware
- 5G base station & infrastructure
- Flat-panel displays
AS27-s Thermal Insulation Pad
A high-performance thermal insulation material specifically engineered for thermal break applications, featuring an extremely low thermal conductivity of 0.009 W/m*K[cite: 1], which effectively reduces heat transfer between different modules.
In battery systems, high-density electronic devices, and precision component designs, AS27-s serves as an exceptional thermal barrier material to delay heat conduction and reduce thermal propagation risks, further enhancing system safety and reliability.
FEATURES
- Thermal conductivity: 0.009 W/m*K
- Excellent thermal insulation
- Lightweight Design
- Effectively reduces heat transfer between modules
- Designed for use in high-reliability electronic devices
TYPICAL APPLICATION
- Automotive electronic devices
- Battery module
- Mobile communication device
- VR devices
- Wearable devices
- Drone & aircraft
- Industrial Applications
Welcome to Visit LiPOLY's Booth for Technology Exchange
LiPOLY has long focused on the R&D of thermally conductive and thermally insulating materials, dedicating our expertise to helping customers solve various thermal management challenges during product development.
We firmly believe that thermal interface materials are not just a component of the product, but a critical key affecting reliability, performance, and product competitiveness.
We cordially invite you to visit Booth 3-A16 at Techno Frontier 2026 to engage with Shiu Li Technology and explore more efficient, high-reliability thermal management solutions together.
We look forward to seeing you in Tokyo.
