RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO 45001
IECQ 080000

Ultra20PT-s Single-Part Thermal Conductive Adhesive

20.0W/m·K
Ultra18PT-s is a Single-Part Thermal Conductive Adhesive with thermal conductivity of 18.0 W/m·K, low thermal impedance, electrical insulation and automated dispensing capability for AI, HPC, data centers, automotive electronics and power modules.

CATEGORY

Thermal Putty

FEATURES

  • 20.0 W/m·K thermal conductivity
  • Single-component packaging with excellent dispensing and automated processability
  • Working time at 25°C: 3 days; heat curing at 100°C for 60 m
  • Soft and compressible, accommodating surface irregularities and reducing com
  • Excellent electrical insulation performance
  • Dissipation Factor, Df = 0.0008 @ 10 MHz
  • Excellent resistance to flow

CONFIGURATIONS

  • Cartridges: 30ml, 55ml

TYPICAL APPLICATION

  • Artificial Intelligence (AI)
  • High Performance Computing (HPC)
  • Data Centers
  • Optical Communication
  • High-Speed Networking
  • Enterprise Storage
  • Industrial Electronics

TYPICAL PROPERTIES

Property Ultra20PT-s UNIT TEST METHOD
Color Gray – Visual
Resin Base Silicone – –
Flow rate (30cc EFD tube,2.35mm Orifice diameter,90psi&30s) 53 g/30sec Internal Test Method
Density 3.1 g/cm³ ASTM D792
Hardness 85 Shore OO ASTM D2240
Application temperature -60~150 °C –
Bond line thickness 100~1500 μm –
Working time@25°C 3 Days Internal Test Method
Cure@100°C 60 Min Internal Test Method
Cure@140°C 2 Min Internal Test Method
Lap shear to aluminum 20 N/cm² ASTM D1002
Shelf Life 6 months – –
RoHS & REACH Compliant – –
ELECTRICAL @ 1.0mm
Dielectric breakdown 14 KV/mm ASTM D149
Surface resistivity >1012 Ohm ASTM D257
Volume resistivity >1012 Ohm-m ASTM D257
Dielectric constant@10MHz Dk 6.3 – ASTM D150
Dissipation factor@10MHz Df 0.0008 – ASTM D150
THERMAL
Thermal conductivity 20.0 W/m·K ASTM D5470
Thermal impedance@10 psi 0.045 °C·in²/W ASTM D5470

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