RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000

Liquid series

Thermal liquid gap fillers are high-flow, thermally conductive materials designed to fill gaps between electronic components and heat sinks. Compared to traditional thermal pads, these liquids can fully cover irregular surfaces, ensuring superior heat transfer performance. They are suitable for applications with high thermal demands, such as electric vehicle battery modules, servers, and LED lighting systems.

Thermal Putty

NEP230

3.0 W/m·K
Low outgassing
Adhesive

TPS5868

3.0 W/m·K
Encapsulants

EP770

2.5 W/m·K
Low outgassing
Encapsulants

NEP220

2.2 W/m·K
Low outgassing
Adhesive

PK223DM

2.2 W/m·K
Fast Curing in room temperature

TPS586

1.5 W/m·K
Encapsulants

G3380NA

1.3 W/m·K
Low outgassing
Low minimum bond line

G3380A

1.3 W/m·K
Low minimum bond line

TPS589

0.8 W/m·K
Encapsulants

Thermal Solutions Expert

LiPOLY® Advance TIMs

Taoyuan City, Bade District, Yongfeng Road, No. 435

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