NEW
DTT56-s Thermal Conductive Die Attach Adhesive
Thermal conductivity：
6.0 W/m·K
This product is a high thermal conductivity liquid material designed for AI chip cooling, offering excellent gap-filling capability and heat-curable properties to effectively reduce junction temperatures in high-performance computing systems. Its stable material structure makes it an ideal thermal interface material for immersion cooling, maintaining consistent thermal performance under prolonged liquid exposure and thermal cycling conditions.
FEATURES
- 6.0 W/m·K thermal conductivity for effective AI chip junction temperature reduction
- Liquid gap-filling material that becomes heat-cured for long-term resistance to fluid flow and thermal cycling in high-load EV applications
- Heat-cured for high structural stability under long-term fluid flow and thermal cycling
- Compatible with immersion cooling, with no dissolution, swelling, or contaminant leaching
- High reliability with stable thermal performance under long-term high-temperature operation
CONFIGURATIONS
- Cartridges: 50ml, 400ml
- Other special and custom sizes are available upon request
TYPICAL APPLICATION
- AI GPU Modules (NVIDIA, AMD, and proprietary ASICs)
- AI Servers with Immersion Cooling
- High-Power Accelerator Cards, including OAM, HGX, and custom-designed modules
- Liquid Cooling / Immersion Hybrid Thermal Architecture
- High-Performance Computing (HPC) Systems
- Industrial Servers / Industrial Control Computing Platforms
- Power Modules / Power Electronics Cooling
- Telecommunications / 5G High-Density Computing Modules
- EV / New Energy High-Power Electronic Modules
Specifications
| Property | DTT56-s | UNIT | TEST METHOD |
|---|---|---|---|
| Color | White (A part) Gray (B part) |
– | Visual |
| Solid content | 100% (Two-part：100:100) |
– | – |
| Viscosity A | 273 | Pa.s | ISO 3219 |
| Viscosity B | 273 | Pa.s | ISO 3219 |
| Density | 3.3 | g/cm³ | ASTM D792 |
| Lap shear to aluminum | 12 | N/cm² | ASTM D1002 |
| Shelf Life | 24 months | – | – |
| RoHS & REACH | Compliant | – | – |
| SOLID(AFTER CURE) | |||
| Thermal conductivity | 6.0 | W/m·K | ASTM D5470 |
| Bond line thickness | 10 | μm | – |
| Hardness | 20 | Shore A | ASTM D2240 |
| Volume resistivity | >1012 | Ohm-m | ASTM D257 |
| Dielectric breakdown | 14 | KV/mm | ASTM D149 |
| Long-term operating temperature | -60～200 | °C | – |
| Operating ambient temp | 20～30 | °C | – |
| Curing conditions | |||
| Pot life @ 25°C | 60 | min | Internal Test Method |