NEW
Ultra3065 Ultra-High Thermal Conductivity Insulating Gap Filler Pad
Thermal conductivity：
30.0 W/m·K
Ultra3065 delivers a high thermal conductivity of 30.0 W/m·K. Its excellent compressibility and conformability accommodate component height variations and uneven surfaces, while Shore OOO 65 hardness balances surface conformity with mechanical support.
It also provides excellent electrical insulation, with a dielectric breakdown strength of 9 kV/mm, making it suitable for high-density electronic assemblies. Custom thicknesses and dimensions are available for AI servers, GPUs, CPUs, HBM packages, power modules, and other high-power applications.
FEATURES
- Ultra-high thermal conductivity
- Excellent compressibility and conformability
- Reliable thermal interface performance
- Excellent electrical insulation performance
- Designed for high-power computing
CONFIGURATIONS
- Customizable
TYPICAL APPLICATION
- AI & HPC：AI Servers • GPUs • CPUs • Accelerators
- Data Center：Servers • Networking • Telecom Equipment
- Power Electronics：Power Modules • High-Power Computing
Specifications
| Property | Ultra3065 | UNIT | TEST METHOD |
|---|---|---|---|
| Thermal conductivity | 30.0 | W/m·K | ASTM D5470 |
| Hardness | 65 | Shore OOO | ASTM D2240 |
| Withstand voltage | 9 | KV/mm | ASTM D149 |