NEW
Non-Silicone
N800D Low-Outgassing Non-Silicone Thermal Pad
Thermal conductivity：
23.0 W/m·K
LiPOLY N800D is a low-volatility thermal pad formulated with a non-silicone resin system, offering a high thermal conductivity of 23.0 W/m·K, a dielectric strength of 8.5 kV/mm, and a hardness of Shore OO 70. Its flexibility and compressibility allow it to conform to uneven contact surfaces, providing thermal conduction and electrical insulation while reducing mechanical stress. It is well suited for applications with stringent requirements for cleanliness, reliability, and contamination control.
FEATURES
- Thermal conductivity：23.0 W/m·K
- Non-silicone resin system
- ASTM E595 compliant
- Excellent flexibility and compressibility
- High dielectric strength with low mechanical stress
- For contamination-sensitive applications
CONFIGURATIONS
- Customizable
TYPICAL APPLICATION
- AI / HPC：GPU、ASIC、HBM、VRM
- Semiconductor Equipment：800G / 1.6T transceiver, silicon photonics
- Semiconductor Equipment：Wafer inspection, metrology, vacuum equipment
- Optical Systems：Camera, LiDAR, laser
- Automotive Electronics：ADAS, domain controller, radar
- Telecommunication：5G / 6G, network equipment, edge computing
- Satellite & Aerospace：Satellite electronics, payload, communication module
Specifications
| Property | N800D | UNIT | TEST METHOD |
|---|---|---|---|
| Thermal conductivity | 23.0 | W/m·K | ASTM D5470 |
| Hardness | 70 | Shore OO | ASTM D2240 |
| Dielectric breakdown | 8.5 | KV/mm | ASTM D149 |