NEW
Thermal Absorber Film
Thermal conductivity：
1.5 W/m·K
Multifunctional Thin Thermal EMI Absorber Film as an innovative functional composite material, offer modern electronic engineering an effective solution to tackle both heat dissipation and EMI challenges simultaneously.
Attenuation
FEATURES
- Thermal Conductivity: 1.5 W/m·K
- 具備優異的吸收特性
- Natural tack for easy process application
- 可重工處理
CONFIGURATIONS
- Sheets form
- Die-cuts parts
TYPICAL APPLICATION
- / IC, CPU, MOS, LED, M/B, Heat sink
- 平面顯示器、電腦及週邊設備、電信硬體設備、無線分享器
- DDR II模組、DVD應用、手持裝置應用
- 5G base station & infrastructure
- 2.4 GHz Wi-Fi無線分享器、藍牙
- 3.5 GHz 5G行動網路
- 5.0 GHz Wi-Fi無線分享器
- 12~18 GHz低軌道衛星系統（LEO）
- 28 GHz 5G行動網路39 GHz 5G行動網路
Specifications
| PROPERTY | Thermal Absorber Film | UNIT | TEST METHOD |
|---|---|---|---|
| Color | Dark Gray | - | Visual |
| Surface tack 2-side/1-side | 2 | - | - |
| Thickness | 0.2 | mm | ASTM D374 |
| Density | 3.1 | g/cm³ | ASTM D792 |
| Hardness | 25 | Shore A | ASTM D2240 |
| TML | 0.04 | % | By LiPOLY |
| Water absorption | 0.04 | % | ASTM D570 |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 1.5 | W/m*K | ASTM D5470 |
| Thermal impedance@10 psi | 0.324 | °C-in²/ W | ASTM D5470 |
| Thermal impedance@50 psi | 0.288 | °C-in²/ W | ASTM D5470 |