RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000

Why Does an Immersion Cooling System Still Require Thermal Pads? Analysis of the Critical Heat Dissipation Mechanism

Many believe that immersion cooling systems can directly dissipate heat, making thermal interface materials unnecessary. However, in practical applications, gaps still exist between chips, heatsinks, and other components. Without appropriate thermal pads, heat transfer efficiency decreases, and system reliability may be compromised. Understanding the role of a Thermal Pad in an immersion cooling environment is a critical key to enhancing thermal performance.
Immersion cooling system using thermal pads to improve heat transfer efficiency in AI servers and high-performance computing applications

Although immersion cooling systems fully submerge components in coolant, coolant alone is insufficient for effective heat dissipation.

Low Thermal Conductivity of Coolant

The thermal conductivity of coolant is far lower than that of metals or high-thermal-conductivity solid materials. Therefore, to enable effective heat conduction to large-area heat dissipation structures, high-thermal-conductivity materials are still needed between components and heat dissipation structures to fill gaps and increase contact area, ensuring rapid heat conduction.

Protection of Sensitive Components

Some components may not be suitable for long-term direct contact with coolant. Thermal pads can not only improve thermal conduction but also serve as isolation layers, providing additional protection for sensitive components and enhancing system safety.

Boundary Layer and Convection Limitations

In single-phase immersion systems, heat transfer mainly relies on forced convection. However, coolant flow velocity on component surfaces may be limited due to shielding, forming boundary layers that affect heat dissipation efficiency. By directing heat through thermal pads to heat sink surfaces with better flow, hotspot temperatures can be effectively reduced.

Replacement of Traditional Thermal Paste

Traditional thermal paste easily dissolves or is lost in immersion environments, while Engineered Fluids certified DTT61-s thermal pads can withstand coolant for long periods without contaminating the liquid, maintaining stable high thermal conductivity.

Conclusion

In conclusion, even in immersion cooling solutions where servers are fully submerged in liquid, thermal pads are not a redundant component. They play an indispensable role in optimizing thermal conduction paths, addressing thermal dead spots in complex structures, and providing electrical insulation and mechanical protection, ensuring that the entire system can operate stably and efficiently even under high power density.

Related Products

Thermal Solutions Expert

SHIU LI TECHNOLOGY CO.,LTD

Taoyuan City, Bade District, Yongfeng Road, No. 435

Contact Us

N800C Non-Silicone Thermal Pad – Compliant with ASTM E595 Low Outgassing Standards

View Datasheet