Immersion Cooling
共 2 篇文章
With the exponential growth of high-performance computing (HPC) and artificial intelligence (AI) chips, conventional air cooling and general liquid cooling systems are rapidly approaching their physical thermal limits. Immersion cooling technology has officially emerged as the leading strategic architecture for next-generation data centers and high-power AI server thermal management.
Many believe that immersion cooling systems can directly dissipate heat, making thermal interface materials unnecessary. However, in practical applications, gaps still exist between chips, heatsinks, and other components. Without appropriate thermal pads, heat transfer efficiency decreases, and system reliability may be compromised. Understanding the role of a Thermal Pad in an immersion cooling environment is a critical key to enhancing thermal performance.