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What Thermal Management Problem Do You Need to Solve?
Identify the required function first, then compare the right products
Fill Irregular Gaps
Fill Height Differences
Heat Transfer and EMI Absorption
Thermal Bonding
Rapid Heat Spreading
Heat Transfer and Electrical Insulation
Reduce Contact Resistance
Block or Slow Heat Transfer
Silicone or Non-Silicone?
Choose Based on Operating Environment and Contamination Risk
Siloxane-Free · Contamination-Free
For Precision Electronics & Aerospace
As Fast as 3 Days
Fast Sample Delivery
Accelerate material evaluation and product validation.
As Fast as 10 Days
Flexible Mass Production
Seamlessly move from development to mass production.
Custom Solutions
From R&D and Testing to Mass Production
Custom formulations, precision converting, performance testing, and mass-production support.
Non-Silicone Material Experts
For Clean and Contamination-Sensitive Environments
Minimize siloxane contamination in optical, aerospace, and sensitive components.
Find the Right Material for Your Application
Each type of equipment has different heat sources, space constraints and reliability requirements. Explore the thermal management challenges and material-selection priorities for each industry.
Choose materials with heat transfer, insulation and long-term reliability for lightweight, space-limited aerospace applications.
Choose thermal materials for high-power components and liquid cooling based on interface gaps, assembly and cooling needs.
Engineering the Future of Thermal Management
Through R&D, quality management, and manufacturing expertise, we enhance product performance and long-term reliability.
In an era defined by AI, HPC, EVs,LEO satellites, and next-gen communication, thermal management is vital to product performance and reliability.
LiPOLY (Shiu Li Technology) specializes in world-class Thermal Interface Materials (TIMs) and custom thermal solutions. We help global clients overcome heat challenges and elevate product competitiveness.
Beyond a supplier, we are your trusted innovation partner, engineering the future of thermal management together.
R&D, Validation and Production
We maintain a complete material development and quality management process, from material property analysis and environmental reliability validation to stable mass production.
Understand Critical Material Properties
Our capabilities cover high-conductivity, non-silicone, low-outgassing, electrically insulating and thermally conductive EMI-absorbing materials. Material performance is verified through thermal conductivity, thermal resistance, thickness, hardness and electrical testing.
Validate Long-Term Stability
Environmental tests, including high and low temperatures, aging and thermal cycling, evaluate material performance changes and reliability under harsh conditions and prolonged use.
Connect Custom Development with Production
Materials can be developed according to size, thickness, hardness, tack, shape and supply format, supporting sheets, rolls, die-cut parts and liquid dispensing requirements.
Quality and Responsibility in Every Production Run
LiPOLY maintains comprehensive quality controls from raw materials and production processes to shipment. Responsible supply-chain principles help ensure product consistency, traceability and long-term supply reliability.
Professional Quality
ISO 9001
Quality Management System
IATF 16949
Automotive Quality Management System
ISO 14001
Environmental Management System
IECQ QC 080000
Hazardous Substance Process Management
UL 94
Flammability Standard for Materials
RoHS
Restriction of Hazardous Substances
REACH
Registration, Evaluation, Authorisation and Restriction of Chemicals
D-U-N-S
D-U-N-S Number (Dun & Bradstreet)
Latest Technology and Industry Updates
Thermal Technologies, Material Applications and Exhibition News
Discuss Your Thermal Requirements with Us
For AI servers, optical communications, aerospace and high-power electronics, the LiPOLY engineering team provides material selection, testing, validation and custom development support based on heat-source conditions, interface structures and operating environments.