液態
墊片
吸波
膠帶
輕量
絕緣
石墨
斷熱
矽型 · 導熱材料 ——
/ Thermal conductivity: 15.0 W/m*K
/ High compression rate
/ Extremely low thermal impedance
/ Between CPU and heat sink
/ Between a component and heat sink
/ Flat-panel displays
/ Power supplies
/ High speed mass storage drives
/ Telecommunication hardware
/ 5G base station & infrastructure
/ High-end Chip
| PROPERTY | T-work8000 | TEST METHOD | UNIT |
|---|---|---|---|
| Color | Purple | Visual | - |
| Surface tack 2-side/1-side | 2 | - | - |
| Thickness | Customized | ASTM D374 | mm |
| Density | 3.3 | ASTM D792 | g/cm³ |
| Hardness | 65 | ASTM D2240 | Shore OOO |
| TML | <0.1 | By LiPOLY | % |
| Application temperature | -60~150 | - | °C |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 15.0 | ASTM D5470 | W/m*K |
| Thermal Conductivity | 9.0 | ISO 22007-2 | W/m*K |
| Thermal impedance@10psi | 0.185 | ASTM D5470 | °C-in²/ W |
