NEW
Thermal EMI Absorption
Thermal conductivity：
6.0 W/m·K
A Thermally Conductive EMI Absorption Pad is a composite material that combines high-efficiency heat dissipation and electromagnetic wave absorption capabilities. It fills thermal interface gaps between electronic components and heat sinks, while its absorber layer reduces reflection and resonance within specific frequency bands to suppress electromagnetic interference (EMI)。
Attenuation
FEATURES
- Thermal Conductivity：6.0 W/m·K
- 具備優異的吸收特性
- Natural tack for easy process application
- 可重工處理
CONFIGURATIONS
- Sheets form
- Die-cuts parts
TYPICAL APPLICATION
- / IC, CPU, MOS, LED, M/B, Heat sink
- 平面顯示器、電腦及週邊設備、電信硬體設備、無線分享器
- DDR II模組、DVD應用、手持裝置應用
- 5G base station & infrastructure
- 2.4 GHz Wi-Fi無線分享器、藍牙
- 3.5 GHz 5G行動網路
- 5.0 GHz Wi-Fi無線分享器
- 12~18 GHz低軌道衛星系統（LEO）
- 28 GHz 5G行動網路
- 39 GHz 5G行動網路
Specifications
| PROPERTY | Thermal EMI Absorption | UNIT | TEST METHOD |
|---|---|---|---|
| Color | Dark Gray | - | Visual |
| Surface tack 2-side/1-side | 2 | - | - |
| Thickness | Customized | mm | ASTM D374 |
| Density | 3.8 | g/cm³ | ASTM D792 |
| Hardness | 75 | Shore OO | ASTM D2240 |
| TML | 0.04 | % | By LiPOLY |
| Water absorption | 0.04 | % | ASTM D570 |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 6.0 | W/m*K | ASTM D5470 |
| Thermal impedance@10 psi | 0.288 | °C-in²/ W | ASTM D5470 |
| Thermal impedance@50 psi | 0.250 | °C-in²/ W | ASTM D5470 |