NEW
SH series Fiberglass-Reinforced Thermal Conductive Pad
Thermal conductivity：
1.5~3.0 W/m·K
This new glass-fiber thermal pad incorporates glass fibers into a silicone substrate, offering both high thermal conductivity and outstanding mechanical strength, suitable for high-insulation, high-vibration, and harsh environments.
Thermal Resistance vs. Pressure
FEATURES
- 熱傳導係數：1.5｜2.0｜3.0 W/m·K
- Excellent insulator
- 可重工處理
- 玻璃纖維強化基材
CONFIGURATIONS
- Roll form
- Sheets form
- Die-cuts parts
TYPICAL APPLICATION
- Switching power supplies
- 馬達控制器
- EV electric vehicle
- Automotive electronic devices
- 5G base station & infrastructure
Specifications
| Item | Glass-Fiber Thermal pad | UNIT | TEST METHOD |
|---|---|---|---|
| Color | Yellow｜Green｜Pink | – | Visual |
| Reinforced layer | Fiberglass | – | – |
| Thickness | 0.25｜0.30｜0.45 | mm | ASTM D374 |
| Density | 2.3｜2.6｜2.8 | g/cm³ | ASTM D792 |
| Hardness | 80 | Shore A | ASTM D2240 |
| Application temperature | Application temperature | °C | – |
| Dielectric breakdown | 4.0｜5.0｜6.0 | KV | ASTM D149 |
| ROHS & REACH | Compliant | – | – |
| THERMAL | |||
| Thermal conductivity | 1.5｜2.0｜3.0 | W/m·K | ASTM D5470 |
| Thermal impedance@20 psi | 0.41｜0.48｜0.56 | °C-in²/ W | ASTM D5470 |
| 熱阻抗 @100 psi | 0.25｜0.30｜0.38 | °C-in²/ W | ASTM D5470 |