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非矽型 · 輕量化導熱系列

Silicone Free lightweight thermal interface materials are rapidly transforming the development trajectory of thermal management technology in electronic products. Not only address concerns about silicone contamination in sensitive electronic devices but also achieve significant weight reduction through innovative material design while maintaining or enhancing thermal conductivity performance.

Non-silicone low-density thermal putty is a specialized material designed for electronic thermal management. Unlike traditional silicone-based thermal materials, it contains no silicone oil, effectively preventing issues such as contact failure or contamination caused by silicone oil migration. This makes it especially suitable for optical or precision electronic components that are sensitive to silicone.

NL-putty04

4.0 W/m·K
Low outgassing
No Vertical Flow
Non-silicone lightweight thermal gel features a “non-silicone” property that prevents the silicone oil migration issues sometimes found in traditional silicone gels, effectively protecting optical or electronic components sensitive to silicone. Its “low-density” characteristic helps achieve product lightweighting and reduces stress on precision components.

NL-putty06

6.0 W/m·K
Low outgassing
No Vertical Flow

NL-putty10

10.0 W/m·K
Low outgassing
No Vertical Flow

NL-putty10

10.0 W/m·K
Low outgassing
No Vertical Flow
Non-silicone lightweight thermal gel features a “non-silicone” property that prevents the silicone oil migration issues sometimes found in traditional silicone gels, effectively protecting optical or electronic components sensitive to silicone. Its “low-density” characteristic helps achieve product lightweighting and reduces stress on precision components.

NL-putty06

6.0 W/m·K
Low outgassing
No Vertical Flow
Non-silicone low-density thermal putty is a specialized material designed for electronic thermal management. Unlike traditional silicone-based thermal materials, it contains no silicone oil, effectively preventing issues such as contact failure or contamination caused by silicone oil migration. This makes it especially suitable for optical or precision electronic components that are sensitive to silicone.

NL-putty04

4.0 W/m·K
Low outgassing
No Vertical Flow

NL-putty10

10.0 W/m·K
Low outgassing
No Vertical Flow
Non-silicone lightweight thermal gel features a “non-silicone” property that prevents the silicone oil migration issues sometimes found in traditional silicone gels, effectively protecting optical or electronic components sensitive to silicone. Its “low-density” characteristic helps achieve product lightweighting and reduces stress on precision components.

NL-putty06

6.0 W/m·K
Low outgassing
No Vertical Flow
Non-silicone low-density thermal putty is a specialized material designed for electronic thermal management. Unlike traditional silicone-based thermal materials, it contains no silicone oil, effectively preventing issues such as contact failure or contamination caused by silicone oil migration. This makes it especially suitable for optical or precision electronic components that are sensitive to silicone.

NL-putty04

4.0 W/m·K
Low outgassing
No Vertical Flow

Thermal Solutions Expert

SHIU LI TECHNOLOGY CO.,LTD

Taoyuan City, Bade District, Yongfeng Road, No. 435

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Product News | N700C, N800A, N800B, and N800C Non-Silicone Thermal Pads Comply with ASTM E595 Test Requirements. For detailed specifications, please refer to the product datasheets.