RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000

Silicone・TIMs

Silicon-based thermal interface materials feature ultra-high thermal conductivity, providing effective heat dissipation enhancement and enabling equipment to maintain high-performance operation for extended periods. They typically use silicone oil or silicone elastomers as the base material, mixed with metal oxides or other high thermal conductivity fillers. Thermal pads are suitable for gap-filling thermal conduction applications with multiple heat sources, commonly used in automotive electronics, 5G base stations, and aerospace fields.

DTT54-s

4.0 W/m·K
Stable thermal performance at elevated temperatures.

PK404

4.0 W/m·K
General Series

PK404DM-H

3.6 W/m·K
Fast Curing in room temperature

H-putty

3.5 W/m·K
No Vertical Flow

S-putty

3.5 W/m·K
No Vertical Flow

G3380B

3.2 W/m·K
Low minimum bond line

S818

3.2 W/m·K
Tensile strength 0.44 MPa

DTT44-s

3.0 W/m·K
Low Dk/Df

TEM96B

3.0 W/m·K
Thermal & Absorber

BS75K-s

3.0 W/m·K
Shore OO/18

SH3000

3.0 W/m·K
Fiberglass reinforced

BS87-s

3.0 W/m·K
Shore OO/10

S-putty

3.5 W/m·K
No Vertical Flow

S-putty2-s

6.0 W/m·K
No Vertical Flow

S-putty5-s

10.0 W/m·K
No Vertical Flow

S282-s

2.5 W/m·K
Fiberglass reinforced

S393

2.2 W/m·K
Tensile strength 0.75 MPa

S818

3.2 W/m·K
Tensile strength 0.44 MPa

SH-putty3

8.0 W/m·K
No Vertical Flow

SH1500

1.5 W/m·K
Fiberglass reinforced

SH2000

2.0 W/m·K
Fiberglass reinforced

SH3000

3.0 W/m·K
Fiberglass reinforced

SP-23

0.8 W/m·K
TO220 / TO3P

ST6000-S

1.8 W/m·K
耐高温180℃

For all informaton you need

CALL US: 03-3788588

Thermal Solutions Expert

LiPOLY® Advance TIMs

Taoyuan City, Bade District, Yongfeng Road, No. 435

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N800C Non-Silicone Thermal Pad – Compliant with ASTM E595 Low Outgassing Standards

View Datasheet