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IATF 16949
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IECQ 080000

Silicone・TIMs

Silicon-based thermal interface materials feature ultra-high thermal conductivity, providing effective heat dissipation enhancement and enabling equipment to maintain high-performance operation for extended periods. They typically use silicone oil or silicone elastomers as the base material, mixed with metal oxides or other high thermal conductivity fillers. Thermal pads are suitable for gap-filling thermal conduction applications with multiple heat sources, commonly used in automotive electronics, 5G base stations, and aerospace fields.

導熱矽膠片PK404

PK404

4.0 W/m·K
General

TEM96C

4.0 W/m·K
Thermal & Absorber

AS400-s

4.0 W/m·K
Oil bleed width < 1mm

DTT54-s

4.0 W/m·K
Stable thermal performance at elevated temperatures.

PK404DM-H

3.6 W/m·K
Fast Curing in room temperature
Silicone thermal putty is a thermal interface material made from a silicone base combined with thermally conductive powders, blended using specialized equipment. It offers excellent thermal conductivity, insulation, and high-temperature resistance. Widely used in electronics, automotive, and LED industries, it enhances heat dissipation efficiency and extends product lifespan by effectively transferring heat from heat-generating components to heat sinks.

H-putty

3.5 W/m·K
No Vertical Flow

S-putty

3.5 W/m·K
No Vertical Flow
Thermal paste G3380B

G3380B

3.2 W/m·K
Low minimum bond line

S818

3.2 W/m·K
Tensile strength 0.44 MPa

TEM96B

3.0 W/m·K
Thermal & Absorber

BS87-s

3.0 W/m·K
Shore OO/10

DTT44-s

3.0 W/m·K
Lightweight

PK700DM

7.0 W/m·K
Fast Curing in room temperature

S-putty

3.5 W/m·K
No Vertical Flow
Thermal silicone putty is a polymer thermal interface material made with a silicone base and added thermal conductive fillers. It offers both electrical insulation and mechanical protection, efficiently transferring and dissipating heat. Thermal silicone is primarily used for thermal management and heat dissipation in industries such as electronics, electrical engineering, automotive, and lighting. Due to its high thermal conductivity, insulation, softness, and high-temperature resistance, thermal silicone has become an indispensable material for thermal management in modern electronic and electrical products.

S-putty2-s

6.0 W/m·K
No Vertical Flow

S-putty5-s

10.0 W/m·K
No Vertical Flow

S282-s

2.5 W/m·K
Fiberglass reinforced

S393

2.2 W/m·K
Tensile strength 0.75 MPa

S818

3.2 W/m·K
Tensile strength 0.44 MPa
Thermal gel, compared to thermal grease, features non-flowing and anti-sagging properties, making it easier to clean. It can replace thermal pads and offers characteristics such as low oil bleed and non-flowing behavior. Thermal gel can fill larger gaps and simultaneously encapsulate various irregular components, maintaining stability even at high temperatures. Additionally, it provides higher dielectric breakdown voltage insulation, making it suitable for high-power electronic and electrical components.

SH-putty3

8.0 W/m·K
No Vertical Flow

SH1500

1.5 W/m·K
Fiberglass reinforced

SH2000

2.0 W/m·K
Fiberglass reinforced

SH3000

3.0 W/m·K
Fiberglass reinforced
SP-23 thermal silicone cap is a product that combines "high-efficiency heat dissipation" and "electrical insulation" properties, commonly used for electronic components with TO-220, TO-247, TO-3P package forms, or in applications such as power modules, power semiconductors, LED lighting, and automotive electronics to achieve both thermal management and insulation purposes simultaneously.

SP-23

0.8 W/m·K
TO220 / TO3P

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Product News | N700C, N800A-s, N800B, and N800C Non-Silicone Thermal Pads Comply with ASTM E595 Test Requirements. For detailed specifications, please refer to the product datasheets.