RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO 45001
IECQ 080000

Silicone・TIMs

Silicon-based thermal interface materials feature ultra-high thermal conductivity, providing effective heat dissipation enhancement and enabling equipment to maintain high-performance operation for extended periods. They typically use silicone oil or silicone elastomers as the base material, mixed with metal oxides or other high thermal conductivity fillers. Thermal pads are suitable for gap-filling thermal conduction applications with multiple heat sources, commonly used in automotive electronics, 5G base stations, and aerospace fields.

4.5 W/m·K
Low minimum bond line
4.0 W/m·K
Thermal & Absorber
4.0 W/m·K
Stable thermal performance at elevated temperatures.
3.6 W/m·K
Fast Curing in room temperature
3.5 W/m·K
No Vertical Flow
3.5 W/m·K
No Vertical Flow
3.2 W/m·K
Low minimum bond line
3.2 W/m·K
Tensile strength 0.44 MPa
3.0 W/m·K
Fiberglass reinforced
7.0 W/m·K
Fast Curing in room temperature
3.5 W/m·K
No Vertical Flow
6.0 W/m·K
No Vertical Flow
10.0 W/m·K
No Vertical Flow
2.5 W/m·K
Fiberglass reinforced
2.2 W/m·K
Tensile strength 0.75 MPa
3.2 W/m·K
Tensile strength 0.44 MPa
8.0 W/m·K
No Vertical Flow
1.5 W/m·K
Fiberglass reinforced
2.0 W/m·K
Fiberglass reinforced
3.0 W/m·K
Fiberglass reinforced
0.8 W/m·K
TO220 / TO3P

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Product News | N700C, N800A-s, N800B, and N800C Non-Silicone Thermal Pads Comply with ASTM E595 Test Requirements. For detailed specifications, please refer to the product datasheets.