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High Thermal ConductiveGap Filler Pad

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LiPOLY will present advanced Thermal Interface Materials designed for AI computing applications at PCIM Europe 2026, featuring Immersion Cooling Thermal Conductive Pads and high-performance Non-Silicone Thermal Conductive Pads.

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SHIU LI TECHNOLOGY CO., LTD.

Taoyuan City, Bade District, Yongfeng Road, No. 435

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News | N-putty5, N700C & N800 Series non-silicone thermal materials meet ASTM E595 requirements. See datasheets.