This product is a high thermal conductivity liquid material designed for AI chip cooling, offering excellent gap-filling capability and heat-curable properties to effectively reduce junction temperatures in high-performance computing systems. Its stable material structure makes it an ideal thermal interface material for immersion cooling, maintaining consistent thermal performance under prolonged liquid exposure and thermal cycling conditions.
In addition, this heat-curable liquid TIM for EV applications is engineered to withstand long-term thermal cycling, making it suitable for electric vehicles and other high-load operating environments. It delivers a reliable thermal management solution for advanced electronics and automotive applications requiring long-term stability and high reliability.

DTT54-s features a thermal conductivity of 4.0 W/m·K and provides a structurally stable, high-performance thermal interface layer. It is designed for use between chips and cold plates or other heat dissipation structures, forming a low thermal interface resistance and a long-term reliable heat transfer path to effectively reduce junction temperatures. Even under prolonged immersion in cooling fluids, the material resists loss, displacement, and performance degradation, ensuring stable and reliable thermal performance during long-term operation.

Thermal pads for single-phase immersion cooling feature optimized chemical formulations tested for durability and high-temp operation. Designed for high-power uses like AI servers and data centers, they improve thermal management and system stability.

The fiberglass Cloth reinforced Thermal Pads use glass fiber cloth filled with thermally conductive compounds, combining strength and heat conduction for electronics heat transfer and insulation.