Single-phase and two-phase immersion cooling are critical technologies for AI server thermal management. By submerging servers in a dielectric fluid, the challenge of overheating can be effectively addressed. The selection between single-phase and two-phase coolants hinges on two primary factors—deployment cost and cooling efficiency—where single-phase cooling is suitable for simpler, cost-sensitive systems, and two-phase systems are the preferred choice for high-performance heat dissipation needs.

Immersion cooling technology submerges electronic devices completely in non-conductive coolant, which seems to provide direct heat dissipation. However, the thermal conductivity of coolant is far lower than that of metal heat sinks. Liquid convection alone cannot effectively handle the concentrated heat generated by electronic components. Thermal pads can fill microscopic gaps between components and heat dissipation structures, providing higher thermal conductivity pathways, overcoming boundary layer limitations, and replacing easily dissolved traditional thermal paste to ensure optimal heat dissipation efficiency in immersion systems