Liquid series
High-Flow gap fillers fully cover irregular surfaces, unlike thermal pads.
Solid series
Including high ductile, ultra-thin, ultra-soft, and low-bleed Thermal pads.
EMI Shielding Pad
Thermal conductive & RF absorption, enhancing product reliability.
Tape series
Reduces heatsink bonding steps while solving fixation and thermal issues.
Lightweight series
Reduce device weight while offering high thermal conductivity.
Electrical insulator
Ideal for applications needing both thermal and electrical solutions.
Graphite Sheets
Ultra-thin, flexible, perfect for space-saving & high-performance devices.
Thermal Break
Lightweight composite withstands 1300°C to prevent thermal runaway.
New products
Newest
Shiu Li Technology is committed to yearly launches of new innovations, delivering excitement. More than grand events, these launches showcase our strength. With our team's breakthroughs, your products will set trends—this is Shiu Li Technology's power!
Technologies
Development
In line with technological development trends and the global environmental protection movement, we continuously deliver outstanding R&D outputs in product and process development.
Material Analysis
Control of hazardous substances in accordance with customer and environmental requirements.
Reliability Laboratory
Effectively control and prevent all potential quality issues that may occur.
Manufacture
Cleanrooms, automated equipment, and diverse molding technologies.
Patents
Holds multiple global patents for thermal conductive materials.
Company
About Us
LiPOLY® TIMs Technology possesses profound technical expertise and extensive application experience, with top-tier talent from diverse fields dedicated to developing high-performance thermal management and innovative materials. Equipped with state-of-the-art laboratory facilities and automated manufacturing equipment, we conduct high-precision testing and analysis to ensure product stability and reliability.
Professional Quality
We maintain a comprehensive quality management system and have obtained international certifications.
Company History
In June 2002, we developed and manufactured the first batch of K0.8 to K3 thermally conductive materials.
Responsible Business Alliance
RBA Code of Conduct
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邊緣運算減少了數據傳輸到雲端的延遲，特別適用於需要快速反應的場景。將數據處理移至靠近數據生成位置的邊緣運算裝置，例如無人機上的嵌入式系統可以在追蹤或災害救援中，實現即時分析與決策。
因體積小，但元件高頻，高功率，高電壓等特性，在解決熱對策方案工程師們積極尋找超低熱阻，高導熱係數，高可靠度的介面材料，有助於提高性能、降低外部環境衝擊和機械應力、提高使用壽命，從而降低成本。
全球5G主要創新應用案例逐步啟動，5Ｇ包括邊緣運算，物聯網，車聯網，應用涵蓋5G智慧銀行，低延遲雲存儲解決方案 ，5G災害醫療支援，5G遙距操控搜索平台 等...
產品效能較一般3C 應用高階。更高規格的MIL-STD測試規範，在落下，強固，防水，防塵，防震等。而更是要求導熱材料的的信賴性，耐燃，防干擾等。
旭立科技已開發高可靠度的車用材料，包含低密度，低黏度，高結合性的灌封、搭接等高導熱高絕緣介面材料。因應設計的不同，我們持續與客戶開發客製化的材料，包括客製化特性，客製化製程應用，客製化符合設計應用的材料。
旭立科技開發高導熱的非矽行的材料，能有效將熱源傳遞到散熱模組，且不產生低分矽氧烷，並確保PCB電性正確，鏡頭影像不受影響。
需顧慮產品因時因地的環境氣候考量，導熱的要求相對高度嚴謹，旭立科技擁有創新應變能力，開發出多款導熱片、導熱絕緣片、高絕緣導熱雙面膠、導熱灌封膠…等複合式材料解決方案
多功能晶片在輕薄短小的空間中，執行高速運算過程會產生大量的熱能，而熱對策方案從被動式的對流，傳導，均溫，甚至熱輻射的方案皆能依產品的設計，訴求不同而廣泛的應用在不同3C產品中。
Thermal Solutions Expert
LiPOLY® Advance TIMs
Taoyuan City, Bade District, Yongfeng Road, No. 435
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