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Single-Phase Immersion Cooling

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With the exponential growth of high-performance computing (HPC) and artificial intelligence (AI) chips, conventional air cooling and general liquid cooling systems are rapidly approaching their physical thermal limits. Immersion cooling technology has officially emerged as the leading strategic architecture for next-generation data centers and high-power AI server thermal management.

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Product News | N700C, N800A-s, N800B, and N800C Non-Silicone Thermal Pads Comply with ASTM E595 Test Requirements. For detailed specifications, please refer to the product datasheets.