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Thermal Absorbing Gel is a silicone-based thermal interface material that combines efficient heat dissipation with electromagnetic wave absorption. It is designed for high-frequency applications such as 5G, Wi-Fi, Bluetooth, LEO satellites, and high-speed electronic modules. The material fills microscopic gaps between components and heat sinks to reduce thermal contact resistance while absorbing and attenuating electromagnetic interference (EMI), improving thermal performance, signal integrity, and long-term system reliability.
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SHIU LI TECHNOLOGY CO., LTD.
Taoyuan City, Bade District, Yongfeng Road, No. 435
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Product News | N700C, N800A-s, N800B, and N800C Non-Silicone Thermal Pads Comply with ASTM E595 Test Requirements. For detailed specifications, please refer to the product datasheets.


