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Thermal Interface Materials

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As the demand for AI computing continues to grow, heat dissipation has become a critical aspect of server and data center development[cite: 1]. COMPUTEX Taipei 2026 showcases a variety of advanced thermal management technologies, including liquid cooling, immersion cooling, and high-performance thermal interface materials, reflecting the industry's high regard for energy efficiency and system reliability

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Product News | N700C, N800A-s, N800B, and N800C Non-Silicone Thermal Pads Comply with ASTM E595 Test Requirements. For detailed specifications, please refer to the product datasheets.