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Thermal Interface Materials

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As the demand for AI computing continues to grow, heat dissipation has become a critical aspect of server and data center development[cite: 1]. COMPUTEX Taipei 2026 showcases a variety of advanced thermal management technologies, including liquid cooling, immersion cooling, and high-performance thermal interface materials, reflecting the industry's high regard for energy efficiency and system reliability

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LiPOLY® Advance TIMs

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N800C Non-Silicone Thermal Pad – Compliant with ASTM E595 Low Outgassing Standards

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