RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000

Silicone・TIMs

Silicon-based thermal interface materials feature ultra-high thermal conductivity, providing effective heat dissipation enhancement and enabling equipment to maintain high-performance operation for extended periods. They typically use silicone oil or silicone elastomers as the base material, mixed with metal oxides or other high thermal conductivity fillers. Thermal pads are suitable for gap-filling thermal conduction applications with multiple heat sources, commonly used in automotive electronics, 5G base stations, and aerospace fields.

PK223
2.0 W/m·K
General Series
TEM96A
2.0 W/m·K
Absorber
D2000
2.0 W/m·K
Never Pump-out and Dry
TIM12
2.0 W/m·K
No freeze preservation required
ST6000-S
1.8 W/m·K
High Temperature
TPS32
1.5 W/m·K
Sealing Glue
TPS586
1.5 W/m·K
Sealing Glue
G3380A
1.3 W/m·K
Low minimum bond line
ST6000F
1.2 W/m·K
High Temperature
TPS589
0.8 W/m·K
Sealing Glue
TP200
0.8 W/m·K
TO220 / TO3P
SP-23
0.8 W/m·K
TO220 / TO3P
TEM96B
3.0 W/m·K
Absorber
TEM96C
4.0 W/m·K
Absorber
TEM96D
5.0 W/m·K
Absorber
TEM96E
6.0 W/m·K
Absorber
TIM12
2.0 W/m·K
No freeze preservation required
TIM14
4.0 W/m·K
No freeze preservation required
TP200
0.8 W/m·K
TO220 / TO3P
TPS31
0.55 W/m·K
Sealing Glue
TPS32
1.5 W/m·K
Sealing Glue
TPS586
1.5 W/m·K
Sealing Glue
TPS5868
3.0 W/m·K
Sealing Glue
TPS589
0.8 W/m·K
Sealing Glue

For all informaton you need

CALL US: 03-3788588

Thermal Solutions Expert

LiPOLY® Advance TIMs

Taoyuan City, Bade District, Yongfeng Road, No. 435

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