RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000

Silicone・TIMs

Silicon-based thermal interface materials feature ultra-high thermal conductivity, providing effective heat dissipation enhancement and enabling equipment to maintain high-performance operation for extended periods. They typically use silicone oil or silicone elastomers as the base material, mixed with metal oxides or other high thermal conductivity fillers. Thermal pads are suitable for gap-filling thermal conduction applications with multiple heat sources, commonly used in automotive electronics, 5G base stations, and aerospace fields.

AS50-s
5.0 W/m·K
Shore OO/25
PK605DM
5.0 W/m·K
Fast Curing in room temperature
DTT65-s
5.0 W/m·K
Lightweight
G3380K
4.5 W/m·K
Low minimum bond line
DCTP140-s
4.5 W/m·K
Fiberglass reinforced
AS02-s
4.5 W/m·K
厚度 0.15 / 0.20 mm
TIM14
4.0 W/m·K
No freeze preservation required
DTT04-s
4.0 W/m·K
No Vertical Flow
TEM96C
4.0 W/m·K
Absorber
AS400-s
4.0 W/m·K
Oil bleed width < 1mm
PK404
4.0 W/m·K
General Series
PK404DM
3.6 W/m·K
Fast Curing in room temperature
PK223
2.0 W/m·K
General Series
PK223DM
2.2 W/m·K
Fast Curing in room temperature
PK404
4.0 W/m·K
General Series
PK404DM
3.6 W/m·K
Fast Curing in room temperature
PK504
5.0 W/m·K
General Series
PK605
6.0 W/m·K
General Series
PK605DM
5.0 W/m·K
Fast Curing in room temperature
PK700
7.0 W/m·K
General Series
PK700DM
7.0 W/m·K
Fast Curing in room temperature
S-putty
3.5 W/m·K
No Vertical Flow
S-putty2-s
6.0 W/m·K
No Vertical Flow
S-putty5-s
10.0 W/m·K
No Vertical Flow

For all informaton you need

CALL US: 03-3788588

Thermal Solutions Expert

LiPOLY® Advance TIMs

Taoyuan City, Bade District, Yongfeng Road, No. 435

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