RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000

Silicone・TIMs

Silicon-based thermal interface materials feature ultra-high thermal conductivity, providing effective heat dissipation enhancement and enabling equipment to maintain high-performance operation for extended periods. They typically use silicone oil or silicone elastomers as the base material, mixed with metal oxides or other high thermal conductivity fillers. Thermal pads are suitable for gap-filling thermal conduction applications with multiple heat sources, commonly used in automotive electronics, 5G base stations, and aerospace fields.

PK700DM
7.0 W/m·K
Fast Curing in room temperature
The DTT04-s is a Low-density thermal putty. Its lightweight properties reduce production costs, and minimize material usage and energy consumption. It is commonly used in electronic products and automotive electronic devices. With a thermal conductivity of 4.0 W/m*K, this product offers high deformability, allowing flexible adaptation to various gaps and providing tolerance compensation. It effectively addresses issues such as overflow and drying, improves heat transfer, and is suitable for automated dispensing production.
DTT06-s
6.0 W/m·K
No Vertical Flow
DTT56-s
6.0 W/m·K
Stable thermal performance at elevated temperatures.
PK605
6.0 W/m·K
General Series
After applying thermal paste to the surface of the CPU, it effectively eliminates excess air between the processor and the heatsink, enabling high-performance thermal conductivity. This allows the heat generated by the CPU to be transferred to the heatsink more quickly, thereby improving the overall cooling performance of the computer.
G3380T
6.0 W/m·K
Low minimum bond line
Thermal paste plays a crucial role in computer cooling. When processors (CPUs) or graphics cards (GPUs) operate continuously, they generate a significant amount of heat. If cooling performance is insufficient, it not only affects the overall performance of the computer but may also lead to system instability or crashes due to overheating.
TT3000
6.0 W/m·K
Nano Thermal Grease
TEM96E
6.0 W/m·K
Thermal & Absorber
Thermal putty is primarily used to fill gaps between electronic components and heat sinks, enhancing heat dissipation efficiency. It effectively conducts heat, rapidly transferring the heat generated by components to the heat sink, thereby lowering component temperatures and preventing overheating damage. Thermal putty overcomes issues such as overflow and drying out commonly seen with thermal grease, and is an ideal choice for automated dispensing production when used with LiPOLY’s dedicated putty dispensing equipment.
H-putty2
6.0 W/m·K
No Vertical Flow
Thermal silicone putty is a polymer thermal interface material made with a silicone base and added thermal conductive fillers. It offers both electrical insulation and mechanical protection, efficiently transferring and dissipating heat. Thermal silicone is primarily used for thermal management and heat dissipation in industries such as electronics, electrical engineering, automotive, and lighting. Due to its high thermal conductivity, insulation, softness, and high-temperature resistance, thermal silicone has become an indispensable material for thermal management in modern electronic and electrical products.
S-putty2-s
6.0 W/m·K
No Vertical Flow
TEM96D
5.0 W/m·K
Thermal & Absorber
PK605DM
5.0 W/m·K
Fast Curing in room temperature
DTT65-s
5.0 W/m·K
Low Dk/Df
Lightweight thermal putty is a low-density, lightweight thermal material commonly used in lightweight drones and EV (electric vehicle) components. For lightweight drones, reducing weight can directly extend flight endurance, as battery weight accounts for a large proportion; lowering the weight effectively improves the endurance per unit of electrical energy. In electric vehicles, lightweight design also reduces energy consumption and increases battery range.
DTT13-s
13.0 W/m·K
No Vertical Flow
DTT44-s
3.0 W/m·K
Low Dk/Df
DTT44-s
3.0 W/m·K
Lightweight
DTT54-s
4.0 W/m·K
Stable thermal performance at elevated temperatures.
DTT55-s
5.0 W/m·K
Stable thermal performance at elevated temperatures.
DTT56-s
6.0 W/m·K
Stable thermal performance at elevated temperatures.
DTT65-s
5.0 W/m·K
Low Dk/Df
DTT65-s
5.0 W/m·K
Lightweight
The primary function of thermal paste is to fill the microscopic gaps between the CPU and the heatsink, improving thermal conductivity. It helps transfer the heat generated by the CPU quickly and efficiently to the heatsink, thereby lowering the CPU temperature and preventing system instability or damage caused by overheating.
G3380A
1.3 W/m·K
Low minimum bond line
The G3380B series thermal Paste features extremely low thermal resistance and excellent thermal conductivity. It has been widely used in thermal management for consumer electronics and microprocessors. As the temperature of components rises, the viscosity of the grease decreases, allowing it to better wet the interface components. With a thermal conductivity of 3.2 W/m*K, it serves as an effective gap-filling material.
G3380B
3.2 W/m·K
Low minimum bond line
The primary function of thermal paste is to eliminate microscopic gaps and surface irregularities between components. Since air is a poor thermal conductor, these gaps hinder effective heat transfer. By filling these spaces, thermal paste significantly improves thermal conductivity, helping to efficiently dissipate waste heat generated by components such as the CPU to the heatsink. This prevents overheating, ensures system stability, and extends hardware lifespan.
G3380K
4.5 W/m·K
Low minimum bond line
After applying thermal paste to the surface of the CPU, it effectively eliminates excess air between the processor and the heatsink, enabling high-performance thermal conductivity. This allows the heat generated by the CPU to be transferred to the heatsink more quickly, thereby improving the overall cooling performance of the computer.
G3380T
6.0 W/m·K
Low minimum bond line

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