RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000

Silicone・TIMs

Silicon-based thermal interface materials feature ultra-high thermal conductivity, providing effective heat dissipation enhancement and enabling equipment to maintain high-performance operation for extended periods. They typically use silicone oil or silicone elastomers as the base material, mixed with metal oxides or other high thermal conductivity fillers. Thermal pads are suitable for gap-filling thermal conduction applications with multiple heat sources, commonly used in automotive electronics, 5G base stations, and aerospace fields.

PK700
7.0 W/m*K
General Thermal
S-putty2-s
6.0 W/m*K
No Vertical Flow
DTT06-s
6.0 W/m*K
No Vertical Flow
H-putty2
6.0 W/m*K
No Vertical Flow
TEM96E
6.0 W/m*K
Absorber
TT3000
6.0 W/m*K
Nano Thermal Grease
PK605
6.0 W/m*K
General Thermal
G3380T
6.0 W/m*K
Low minimum bond line
DTT65-s
5.0 W/m*K
Absorber
Lightweight
TEM96D
5.0 W/m*K
Absorber
PK605DM
5.0 W/m*K
Fast Curing in room temperature
BS89-s
5.0 W/m*K
Shore OO/25
DTT44-s
3.0 W/m*K
Absorber
Lightweight
DTT65-s
5.0 W/m*K
Absorber
Lightweight
G3380A
1.3 W/m*K
Low minimum bond line
G3380B
3.2 W/m*K
Low minimum bond line
G3380K
4.5 W/m*K
Low minimum bond line
G3380T
6.0 W/m*K
Low minimum bond line
H-putty
3.5 W/m*K
No Vertical Flow
H-putty2
6.0 W/m*K
No Vertical Flow
HC-93
2.5 W/m*K
TO220 / TO3P
PK223
2.0 W/m*K
General Thermal
PK223DM
2.2 W/m*K
Fast Curing in room temperature
PK404
4.0 W/m*K
General Thermal

For all informaton you need

CALL US: 03-3788588

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LiPOLY® Advance TIMs

桃園市八德區永豐路435號

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