RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000

Silicone・TIMs

Silicon-based thermal interface materials feature ultra-high thermal conductivity, providing effective heat dissipation enhancement and enabling equipment to maintain high-performance operation for extended periods. They typically use silicone oil or silicone elastomers as the base material, mixed with metal oxides or other high thermal conductivity fillers. Thermal pads are suitable for gap-filling thermal conduction applications with multiple heat sources, commonly used in automotive electronics, 5G base stations, and aerospace fields.

PK700
7.0 W/m·K
General Series
H-putty2
6.0 W/m·K
No Vertical Flow
TT3000
6.0 W/m·K
Nano Thermal Grease
DTT06-s
6.0 W/m·K
No Vertical Flow
G3380T
6.0 W/m·K
Low minimum bond line
S-putty2-s
6.0 W/m·K
No Vertical Flow
TEM96E
6.0 W/m·K
Absorber
PK605
6.0 W/m·K
General Series
DTT65-s
5.0 W/m·K
Absorber
BS89-s
5.0 W/m·K
Shore OO/25
PK504
5.0 W/m·K
General Series
TEM96D
5.0 W/m·K
Absorber
DTT13-s
13.0 W/m·K
No Vertical Flow
DTT44-s
3.0 W/m·K
Absorber
DTT44-s
3.0 W/m·K
Lightweight
DTT65-s
5.0 W/m·K
Absorber
DTT65-s
5.0 W/m·K
Lightweight
G3380A
1.3 W/m·K
Low minimum bond line
G3380B
3.2 W/m·K
Low minimum bond line
G3380K
4.5 W/m·K
Low minimum bond line
G3380T
6.0 W/m·K
Low minimum bond line
H-putty
3.5 W/m·K
No Vertical Flow
H-putty2
6.0 W/m·K
No Vertical Flow
HC-93
2.5 W/m·K
TO220 / TO3P

For all informaton you need

CALL US: 03-3788588

Thermal Solutions Expert

LiPOLY® Advance TIMs

Taoyuan City, Bade District, Yongfeng Road, No. 435

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