As AI computing, millimeter-wave communications, and high-speed data transmission are integrated into drone platforms, thermal management and electromagnetic interference have become critical design challenges. This article examines thermal EMI absorber applications in AI computing, mmWave radar, communication, and optical modules, including the value of non-silicone materials in reducing the risk of siloxane-related contamination.
Lightweight drones must integrate high-performance electronic equipment within limited space and weight constraints, making thermal management a critical aspect of design[cite: 1]. By selecting appropriate thermal interface materials (TIMs) and thermal management solutions, it not only improves system stability but also helps extend the lifespan of electronic components and enhance flight reliability