AI
Total of 3 articles
Power density inside AI GPU modules keeps climbing, pushing the GPU, HBM, and VRM ever closer to their thermal design limits. This article focuses on GPU chip-level TIM, examining how PCM900 phase change material works and the reliability data behind it.
Package warpage and component height variation can raise HBM junction temperature and trigger thermal throttling. This article explains how gap filler materials address this challenge and reviews Ultra3065's specifications and reliability data.
Optical module power is rising fast — TIM selection must now balance thermal performance with optical surface cleanliness. This article explains the siloxane contamination mechanism and offers non-silicone pad/putty selection guidance.