Non-Silicone Thermal Materials
Total of 3 articles
To address the dual bottlenecks of high heat generation and high-frequency electromagnetic interference (EMI) caused by high-density packaging in semiconductors and electronic equipment, LiPOLY will showcase breakthrough materials at NEPCON Japan 2026 that combine high thermal conductivity with high-frequency wave absorption, helping engineers eliminate electromagnetic noise and reduce thermal resistance.
As AI computing, millimeter-wave communications, and high-speed data transmission are integrated into drone platforms, thermal management and electromagnetic interference have become critical design challenges. This article examines thermal EMI absorber applications in AI computing, mmWave radar, communication, and optical modules, including the value of non-silicone materials in reducing the risk of siloxane-related contamination.
LiPOLY will present advanced Thermal Interface Materials designed for AI computing applications at PCIM Europe 2026, featuring Immersion Cooling Thermal Conductive Pads and high-performance Non-Silicone Thermal Conductive Pads.