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High Thermal Conductive Pad

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PCIM Europe 2026

PCIM Europe 2026 Opens Grandly! LiPOLY Showcases Innovative Advanced Thermal Interface Material Solutions

LiPOLY will present advanced Thermal Interface Materials designed for AI computing applications at PCIM Europe 2026, featuring Immersion Cooling Thermal Conductive Pads and high-performance Non-Silicone Thermal Conductive Pads.

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Product News | N700C, N800A-s, N800B, and N800C Non-Silicone Thermal Pads Comply with ASTM E595 Test Requirements. For detailed specifications, please refer to the product datasheets.