Liquid
Solid
Absorber
Tape
Light
Insulator
Graphite
Break
PK700DM
7.0 W/m·K
Fast Curing in room temperature
Thermal gap filler is used to fill the gaps between heat-generating components and heat sinks, improving thermal conductivity and reducing thermal resistance. It typically comes in a viscous liquid or semi-solid form, making it suitable for precisely filling micro-gaps, such as those between processors and heat sinks. It is an ideal choice for automated dispensing production when paired with LiPOLY's dedicated putty smart machine.
CATEGORY
Thermal Putty
FEATURES
/ Thermal conductivity: 7.0 W/m·K
/ Fast curing in normal atmospheric temperature
/ Great reliability
/ Great sealing in low pressure
CONFIGURATIONS
/ Cartridges: 50ml, 400ml
/ Other special and custom sizes are available upon request
TYPICAL APPLICATION
/ Between CPU and heat sink
/ Between a component and heat sink
/ Power supplies
/ High speed mass storage drives
/ Telecommunication hardware
/ Electric vehicle& Automotive battery
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL PROPERTIES
| PROPERTY | PK700DM | UNIT | TEST METHOD |
|---|---|---|---|
| Color | Gray-A White-B | - | Visual |
| A:B | 100:100 | - | - |
| Viscosity A | 315 | Pa.s | ISO 3219 |
| Viscosity B | 285 | Pa.s | ISO 3219 |
| Density | 2.8 | g/cm³ | ASTM D792 |
| Shelf Life | 24 months | - | - |
| Hardness (AFTER CURE) | 60 | Shore OO | ASTM D2240 |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 7.0 | W/m·K | ASTM D5470 |
| Thermal impedance@10mils BLT | 0.058 | °C-in²/ W | ASTM D5470 |
| Thermal impedance@30mils BLT | 0.170 | °C-in²/ W | ASTM D5470 |
Related Products
PK700DM
7.0 W/m·K
Fast Curing in room temperature
PK605DM
5.0 W/m·K
Fast Curing in room temperature
PK404DM
3.6 W/m·K
Fast Curing in room temperature
PK223DM
2.2 W/m·K
Fast Curing in room temperature