PK700DM
7.0 W/m*K
Fast Curing in room temperature
Liquid
Solid
Absorber
Tape
Light
Insulator
Graphite
Break
PK605DM
5.0 W/m*K
Fast Curing in room temperature
PK605DM is a two-part thermal conductive gap filler that can cure at room temperature or elevated temperatures. Compared to traditional thermal pads, this two-part thermal gap filler offers low stress on components, high thermal conductivity with a thermal conductivity coefficient of 5.0 W/m·K, low viscosity for easy gap filling, and maintains excellent insulation properties.
CATEGORY
Thermal Putty
FEATURES
/ Thermal conductivity: 5.0 W/m*K
/ Fast curing in normal atmospheric temperature
/ Great reliability
/ Great sealing in low pressure
CONFIGURATIONS
/ Cartridges: 50ml, 400ml
/ Other special and custom sizes are available upon request
TYPICAL APPLICATION
/ Between CPU and heat sink
/ Between a component and heat sink
/ Power supplies
/ High speed mass storage drives
/ Telecommunication hardware
/ Electric vehicle& Automotive battery
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL PROPERTIES
| PROPERTY | PK605DM | UNIT | TEST METHOD |
|---|---|---|---|
| Color | Red-A White-B | - | Visual |
| Solid content | Two-part : 100:100 | - | - |
| Viscosity A | 110 | Pa.s | ISO 3219 |
| Viscosity B | 80 | Pa.s | ISO 3219 |
| Density | 3.3 | g/cm³ | ASTM D792 |
| Shelf life | 24 months | - | - |
| Hardness (AFTER CURE) | 85 | Shore OO | ASTM D2240 |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 5.0 | W/m*K | ASTM D5470 |
| Thermal impedance@10mils BLT | 0.092 | °C-in²/ W | ASTM D5470 |
| Thermal impedance@30mils BLT | 0.254 | °C-in²/ W | ASTM D5470 |
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