Liquid Thermal Interface Materials
High-Flow gap fillers fully cover irregular surfaces, unlike thermal pads.
Thermal Pad
Including high ductile, ultra-thin, ultra-soft, and low-bleed Thermal pads.
EMI Shielding Pad
Thermal conductive & RF absorption, enhancing product reliability.
thermal adhesive tape
Reduces heatsink bonding steps while solving fixation and thermal issues.
Lightweight series
Reduce device weight while offering high thermal conductivity.
Electrical insulator
Ideal for applications needing both thermal and electrical solutions.
Graphite Sheets
Ultra-thin, flexible, perfect for space-saving & high-performance devices.
Thermal Break
Lightweight composite withstands 1300°C to prevent thermal runaway.
Technologies
Development
In line with technological development trends and the global environmental protection movement, we continuously deliver outstanding R&D outputs in product and process development.
Material Analysis
Control of hazardous substances in accordance with customer and environmental requirements.
Reliability Laboratory
Effectively control and prevent all potential quality issues that may occur.
Manufacture
Cleanrooms, automated equipment, and diverse molding technologies.
Patents
Holds multiple global patents for thermal conductive materials.
Company
About Us
LiPOLY® TIMs Technology possesses profound technical expertise and extensive application experience, with top-tier talent from diverse fields dedicated to developing high-performance thermal management and innovative materials. Equipped with state-of-the-art laboratory facilities and automated manufacturing equipment, we conduct high-precision testing and analysis to ensure product stability and reliability.
Professional Quality
We maintain a comprehensive quality management system and have obtained international certifications.
Company History
In June 2002, we developed and manufactured the first batch of K0.8 to K3 thermally conductive materials.
Responsible Business Alliance
RBA Code of Conduct
Home > 導熱產品總覽:依需求選擇熱管理材料
For High-Power Electronics
For Precision Electronics & Aerospace
不同設備面臨的熱源、空間與可靠度條件各不相同。深入了解各產業的熱管理挑戰與材料選擇重點。
因應輕量化、有限空間、材料相容性與特殊環境要求,評估兼具導熱、斷熱與長期可靠度的熱管理材料。
面對高功率處理器、記憶體、電源模組及液冷架構產生的高熱流密度,從介面間隙、組裝方式與散熱需求,選擇合適的熱管理材料。
Thermal Solutions Expert
SHIU LI TECHNOLOGY CO., LTD.
Taoyuan City, Bade District, Yongfeng Road, No. 435
Contact Us
Product News | N700C, N800A-s, N800B, and N800C Non-Silicone Thermal Pads Comply with ASTM E595 Test Requirements. For detailed specifications, please refer to the product datasheets.