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IECQ 080000

Liquid series

Thermal liquid gap fillers are high-flow, thermally conductive materials designed to fill gaps between electronic components and heat sinks. Compared to traditional thermal pads, these liquids can fully cover irregular surfaces, ensuring superior heat transfer performance. They are suitable for applications with high thermal demands, such as electric vehicle battery modules, servers, and LED lighting systems.

Thermal Putty
DTT04-s 系列是一種低密度的凝膠填縫材料。低密度、輕量化特性，可為產品提高其性能、降低生產成本及減少材料的使用和能源消耗等，常被應用在電子產品及汽車電子設備上。產品導熱係數4.0 -10.0 W/m*K，具有高變形量，可靈活性的適配間隙，兼具公差補償特性.可克服溢流乾凅問題, 提高熱傳導，適合自動化點膠生產。
DTT04-s
4.0 W/m·K
No Vertical Flow
TIM14
4.0 W/m·K
No freeze preservation required
PK404DM
3.6 W/m·K
Fast Curing in room temperature
Silicone thermal putty is a thermal interface material made from a silicone base combined with thermally conductive powders, blended using specialized equipment. It offers excellent thermal conductivity, insulation, and high-temperature resistance. Widely used in electronics, automotive, and LED industries, it enhances heat dissipation efficiency and extends product lifespan by effectively transferring heat from heat-generating components to heat sinks.
H-putty
3.5 W/m·K
No Vertical Flow
S-putty
3.5 W/m·K
No Vertical Flow
The G3380B series thermal Paste features extremely low thermal resistance and excellent thermal conductivity. It has been widely used in thermal management for consumer electronics and microprocessors. As the temperature of components rises, the viscosity of the grease decreases, allowing it to better wet the interface components. With a thermal conductivity of 3.2 W/m*K, it serves as an effective gap-filling material.
G3380B
3.2 W/m·K
Low minimum bond line
Thermally conductive potting compound (also known as thermally conductive encapsulant) is a liquid slurry with excellent flowability and thermal conductivity. It can cover and fill gaps between electronic components and modules, aiming to enhance heat dissipation and provide electrical insulation to protect components from environmental damage. After curing at room temperature, thermally conductive potting compound offers dustproof, moisture-proof, shockproof, insulation, and thermal conduction functions.
TPS5868
3.0 W/m·K
Sealing Glue
PK223DM
2.2 W/m·K
Fast Curing in room temperature
TIM12
2.0 W/m·K
No freeze preservation required
D2000 is a two-part Curing thermal grease that cures at room or high temperatures, differing from traditional thermal pastes by its adhesive properties. It can be used with thermal grease dispensing services to secure heat-generating components to heat sinks. The cured thermal grease offers extremely low thermal resistance and high reliability, eliminating issues like drying out or overflowing.
D2000
2.0 W/m·K
Never Pump-out and Dry
TPS586 是可以在室溫或高溫下固化雙劑導熱灌封膠，灌封膠是液體流動性導熱膠，可填滿電子器件周圍空氣空間的縫隙，固化後與發熱的電子元件和散熱器保持密切接觸，使電子產品能夠在高功率下運行進行熱傳導，熱傳導係數：1.5 W/m*K的間隙填充材料。
TPS586
1.5 W/m·K
Sealing Glue
電源保護灌封膠 TPS32 是一款輕量化的灌封膠。可為產品提高其性能及減少能源消耗，常被應用在航空航太及汽車電子設備上。導熱係數1.50 W/m*K，，可填滿電子裝置周圍空氣空間的縫隙，固化後與發熱的電子元件和散熱器保持密切接觸，使電子產品能夠在高功率下運作進行熱傳導。能顯著提升產品的可靠度、使用壽命，並降低外界環境帶來的損害風險。
TPS32
1.5 W/m·K
Sealing Glue
Thermal putty is primarily used to fill gaps between electronic components and heat sinks, enhancing heat dissipation efficiency. It effectively conducts heat, rapidly transferring the heat generated by components to the heat sink, thereby lowering component temperatures and preventing overheating damage. Thermal putty overcomes issues such as overflow and drying out commonly seen with thermal grease, and is an ideal choice for automated dispensing production when used with LiPOLY’s dedicated putty dispensing equipment.
H-putty2
6.0 W/m·K
No Vertical Flow
PK605DM
5.0 W/m·K
Fast Curing in room temperature
N-putty2 是具有熱傳導係數：5.0W/m*K的非矽型導熱凝膠，無低分子矽氧烷揮發，不會造成電器接點故障，適合光學產品或敏感的電子原件使用，極低的熱阻值及低應力，可靈活性的適配間隙，兼具公差補償特性，可以克服類似導熱膏溢流、乾凅問題，可以搭配LiPOLY之putty專用智能機，自動化點膠作業生產的理想選擇。
N-putty2
5.0 W/m·K
Low outgassing
Non-silicone thermal grease is especially suitable for applications sensitive to siloxane volatilization, or requiring high cleanliness and high reliability, such as optical, medical, semiconductor, and high-end electronic products. By applying the thermal grease to the CPU surface, it effectively eliminates excess air between the processor and the heat sink, delivering high thermal conductivity performance.
G3380NK
4.5 W/m·K
Low outgassing
The primary function of thermal paste is to eliminate microscopic gaps and surface irregularities between components. Since air is a poor thermal conductor, these gaps hinder effective heat transfer. By filling these spaces, thermal paste significantly improves thermal conductivity, helping to efficiently dissipate waste heat generated by components such as the CPU to the heatsink. This prevents overheating, ensures system stability, and extends hardware lifespan.
G3380K
4.5 W/m·K
Low minimum bond line
TIM14
4.0 W/m·K
No freeze preservation required
DTT04-s 系列是一種低密度的凝膠填縫材料。低密度、輕量化特性，可為產品提高其性能、降低生產成本及減少材料的使用和能源消耗等，常被應用在電子產品及汽車電子設備上。產品導熱係數4.0 -10.0 W/m*K，具有高變形量，可靈活性的適配間隙，兼具公差補償特性.可克服溢流乾凅問題, 提高熱傳導，適合自動化點膠生產。
DTT04-s
4.0 W/m·K
No Vertical Flow
PK404DM
3.6 W/m·K
Fast Curing in room temperature
S-putty
3.5 W/m·K
No Vertical Flow
N-putty 是具有熱傳導係數：3.5 W/m*K的非矽型導熱凝膠，無低分子矽氧烷揮發，不會造成電器接點故障，適合光學產品或敏感的電子原件使用，極低的熱阻值及低應力，可靈活性的適配間隙，兼具公差補償特性，可以克服類似導熱膏溢流、乾凅問題，可以搭配LiPOLY之putty專用智能機，自動化點膠作業生產的理想選擇。
N-putty
3.5 W/m·K
Low outgassing
Silicone thermal putty is a thermal interface material made from a silicone base combined with thermally conductive powders, blended using specialized equipment. It offers excellent thermal conductivity, insulation, and high-temperature resistance. Widely used in electronics, automotive, and LED industries, it enhances heat dissipation efficiency and extends product lifespan by effectively transferring heat from heat-generating components to heat sinks.
H-putty
3.5 W/m·K
No Vertical Flow
The G3380B series thermal Paste features extremely low thermal resistance and excellent thermal conductivity. It has been widely used in thermal management for consumer electronics and microprocessors. As the temperature of components rises, the viscosity of the grease decreases, allowing it to better wet the interface components. With a thermal conductivity of 3.2 W/m*K, it serves as an effective gap-filling material.
G3380B
3.2 W/m·K
Low minimum bond line

Thermal Solutions Expert

LiPOLY® Advance TIMs

Taoyuan City, Bade District, Yongfeng Road, No. 435

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