RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000

Liquid series

Thermal liquid gap fillers are high-flow, thermally conductive materials designed to fill gaps between electronic components and heat sinks. Compared to traditional thermal pads, these liquids can fully cover irregular surfaces, ensuring superior heat transfer performance. They are suitable for applications with high thermal demands, such as electric vehicle battery modules, servers, and LED lighting systems.

Thermal Putty
Silicone thermal putty is a thermal interface material made from a silicone base combined with thermally conductive powders, blended using specialized equipment. It offers excellent thermal conductivity, insulation, and high-temperature resistance. Widely used in electronics, automotive, and LED industries, it enhances heat dissipation efficiency and extends product lifespan by effectively transferring heat from heat-generating components to heat sinks.
H-putty
3.5 W/m·K
No Vertical Flow
S-putty
3.5 W/m·K
No Vertical Flow
The G3380B series thermal Paste features extremely low thermal resistance and excellent thermal conductivity. It has been widely used in thermal management for consumer electronics and microprocessors. As the temperature of components rises, the viscosity of the grease decreases, allowing it to better wet the interface components. With a thermal conductivity of 3.2 W/m*K, it serves as an effective gap-filling material.
G3380B
3.2 W/m·K
Low minimum bond line
Thermally conductive potting compound (also known as thermally conductive encapsulant) is a liquid slurry with excellent flowability and thermal conductivity. It can cover and fill gaps between electronic components and modules, aiming to enhance heat dissipation and provide electrical insulation to protect components from environmental damage. After curing at room temperature, thermally conductive potting compound offers dustproof, moisture-proof, shockproof, insulation, and thermal conduction functions.
TPS5868
3.0 W/m·K
Encapsulants
PK223DM
2.2 W/m·K
Fast Curing in room temperature
TIM12
2.0 W/m·K
No freeze preservation required
D2000 is a two-part Curing thermal grease that cures at room or high temperatures, differing from traditional thermal pastes by its adhesive properties. It can be used with thermal grease dispensing services to secure heat-generating components to heat sinks. The cured thermal grease offers extremely low thermal resistance and high reliability, eliminating issues like drying out or overflowing.
D2000
2.0 W/m·K
Never Pump-out and Dry
TPS586 是可以在室溫或高溫下固化雙劑導熱灌封膠，灌封膠是液體流動性導熱膠，可填滿電子器件周圍空氣空間的縫隙，固化後與發熱的電子元件和散熱器保持密切接觸，使電子產品能夠在高功率下運行進行熱傳導，熱傳導係數：1.5 W/m*K的間隙填充材料。
TPS586
1.5 W/m·K
Encapsulants
The primary function of thermal paste is to fill the microscopic gaps between the CPU and the heatsink, improving thermal conductivity. It helps transfer the heat generated by the CPU quickly and efficiently to the heatsink, thereby lowering the CPU temperature and preventing system instability or damage caused by overheating.
G3380A
1.3 W/m·K
Low minimum bond line
Encapsulation resin refers to a polymer material used to cover, protect, and secure electronic components during the assembly of electronic products. This encapsulating material plays a crucial role in enhancing the reliability, durability, and protective performance of electronic devices.
TPS589
0.8 W/m·K
Encapsulants
PK605DM
5.0 W/m·K
Fast Curing in room temperature
Non-silicone thermal grease is especially suitable for applications sensitive to siloxane volatilization, or requiring high cleanliness and high reliability, such as optical, medical, semiconductor, and high-end electronic products. By applying the thermal grease to the CPU surface, it effectively eliminates excess air between the processor and the heat sink, delivering high thermal conductivity performance.
G3380NK
4.5 W/m·K
Low outgassing
Low minimum bond line
The primary function of thermal paste is to eliminate microscopic gaps and surface irregularities between components. Since air is a poor thermal conductor, these gaps hinder effective heat transfer. By filling these spaces, thermal paste significantly improves thermal conductivity, helping to efficiently dissipate waste heat generated by components such as the CPU to the heatsink. This prevents overheating, ensures system stability, and extends hardware lifespan.
G3380K
4.5 W/m·K
Low minimum bond line
TIM14
4.0 W/m·K
No freeze preservation required
PK404DM
3.6 W/m·K
Fast Curing in room temperature
N-putty 是具有熱傳導係數：3.5 W/m*K的非矽型導熱凝膠，無低分子矽氧烷揮發，不會造成電器接點故障，適合光學產品或敏感的電子原件使用，極低的熱阻值及低應力，可靈活性的適配間隙，兼具公差補償特性，可以克服類似導熱膏溢流、乾凅問題，可以搭配LiPOLY之putty專用智能機，自動化點膠作業生產的理想選擇。
N-putty
3.5 W/m·K
Low outgassing
No Vertical Flow
S-putty
3.5 W/m·K
No Vertical Flow
Silicone thermal putty is a thermal interface material made from a silicone base combined with thermally conductive powders, blended using specialized equipment. It offers excellent thermal conductivity, insulation, and high-temperature resistance. Widely used in electronics, automotive, and LED industries, it enhances heat dissipation efficiency and extends product lifespan by effectively transferring heat from heat-generating components to heat sinks.
H-putty
3.5 W/m·K
No Vertical Flow
The G3380B series thermal Paste features extremely low thermal resistance and excellent thermal conductivity. It has been widely used in thermal management for consumer electronics and microprocessors. As the temperature of components rises, the viscosity of the grease decreases, allowing it to better wet the interface components. With a thermal conductivity of 3.2 W/m*K, it serves as an effective gap-filling material.
G3380B
3.2 W/m·K
Low minimum bond line
G3380NJ is a non-silicone thermal grease with a thermal conductivity of 3.2 W/m*K. It contains no low-molecular-weight siloxane volatilization, preventing electrical contact failures. This makes it suitable for optical products and sensitive electronic components. Featuring extremely low thermal resistance and excellent heat conductivity.
G3380NJ
3.2 W/m·K
Low outgassing
Low minimum bond line
導熱膠是一種結合導熱與黏接功能的材料，廣泛應用於電子元件與散熱結構的介面，能有效傳導熱量並提供機械固定。 NEP230 是非矽型雙劑導熱固定膠，可以在室溫或高溫下固化後具有良好的固定力，與導熱墊片相比，非矽型雙劑導熱固定膠不僅對部件產生低應力、高導熱性、低粘度，同時能保持絕緣性能，無低分子矽氧烷揮發，不會造成電器接點故障，適合光學產品或敏感的電子原件使用，可以搭配LiPOLY之putty專用智能機，自動化點膠作業生產的理想選擇。
NEP230
3.0 W/m·K
Low outgassing
Adhesive
Thermally conductive potting compound (also known as thermally conductive encapsulant) is a liquid slurry with excellent flowability and thermal conductivity. It can cover and fill gaps between electronic components and modules, aiming to enhance heat dissipation and provide electrical insulation to protect components from environmental damage. After curing at room temperature, thermally conductive potting compound offers dustproof, moisture-proof, shockproof, insulation, and thermal conduction functions.
TPS5868
3.0 W/m·K
Encapsulants

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LiPOLY® Advance TIMs

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