EMI Shielding
Total of 2 articles
To address the dual bottlenecks of high heat generation and high-frequency electromagnetic interference (EMI) caused by high-density packaging in semiconductors and electronic equipment, LiPOLY will showcase breakthrough materials at NEPCON Japan 2026 that combine high thermal conductivity with high-frequency wave absorption, helping engineers eliminate electromagnetic noise and reduce thermal resistance.
Aerospace electronic systems must address both heat dissipation from high-power components and high-frequency electromagnetic interference (EMI). This article explains how thermal conductive RF absorbers work, the performance requirements for aerospace environments, typical application scenarios, and how to choose between silicone and non-silicone materials.