AI Servers
Total of 3 articles
Package warpage and component height variation can raise HBM junction temperature and trigger thermal throttling. This article explains how gap filler materials address this challenge and reviews Ultra3065's specifications and reliability data.
As the demand for AI computing continues to grow, heat dissipation has become a critical aspect of server and data center development[cite: 1]. COMPUTEX Taipei 2026 showcases a variety of advanced thermal management technologies, including liquid cooling, immersion cooling, and high-performance thermal interface materials, reflecting the industry's high regard for energy efficiency and system reliability
Many believe that immersion cooling systems can directly dissipate heat, making thermal interface materials unnecessary. However, in practical applications, gaps still exist between chips, heatsinks, and other components. Without appropriate thermal pads, heat transfer efficiency decreases, and system reliability may be compromised. Understanding the role of a Thermal Pad in an immersion cooling environment is a critical key to enhancing thermal performance.