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COMPUTEX TAIPEI-AI機器人區-旭立攤位A0803a

LiPOLY®

2026 COMPUTEX Taipei 台北國際電腦展

Shiu Li Technology invites you to visit COMPUTEX 2026: Embracing the AI 2.0 era, AI significantly enhances human efficiency and convenience, making thermal management an essential consideration in system design[cite: 1]. Backed by solid research and development experience in thermal interface materials, Shiu Li Technology offers customized thermal solutions including silicone, non-silicone, RF absorber, and lightweight properties to discuss new thermal management options with you[cite: 1]. Shiu Li Technology will be exhibiting from June 2 to June 5 at the TWTC Hall 1, AI Robotics Area, Booth A0803a

We sincerely invite industry experts and partners to visit us. Our professional team will be on-site to demonstrate Shiu Li Technology's thermal management solutions in key technologies for AI, robotics, and smart development platforms

COMPUTEX Taipei介紹:

COMPUTEX Taipei is a global leading AI and startup exhibition, gathering Taiwan's tech giants and inviting international AI tech leaders to share the latest technologies. The 2026 event is themed "AI Together," focusing on AI and its surrounding ecosystems, including robotics, AI computing, and smart mobility

  • 展會地點:台北南港展覽館1、2館、世貿1館及台北國際會議中心
  • 展會時間:2026年6月2日至6月5日 
  • 攤位位置:世貿一館 AI機器人區 A0803a
COMPUTEX TAIPEI-AI機器人區-旭立攤位A0803a
旭立攤位示意圖

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Stable thermal performance at elevated temperatures.

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SHIU LI TECHNOLOGY CO., LTD.

Taoyuan City, Bade District, Yongfeng Road, No. 435

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Product News | N700C, N800A-s, N800B, and N800C Non-Silicone Thermal Pads Comply with ASTM E595 Test Requirements. For detailed specifications, please refer to the product datasheets.