Liquid
Solid
Absorber
Tape
Light
Insulator
Graphite
Break
TPS586
1.5 W/m·K
Sealing Glue
Motor potting compound is primarily used to protect electric motor components from environmental factors such as dust, moisture, and vibration. It fills internal gaps within the motor, enhances mechanical strength and insulation performance, and reduces noise and vibration. Unlike general potting compounds, thermally conductive motor potting compound effectively dissipates heat generated during motor operation, lowers component temperature, and extends service life.
CATEGORY
Encapsulants
FEATURES
/ Thermal conductivity: 1.5 W/m·K
/ Two-parts package and easy to use
/ Waterproof and air-tight
/ Thermally conductive vibration dampening
CONFIGURATIONS
/ TPS586 If the interface has organic compounds such as Nitrogen, Phosphorous, Sulfur etc., and heavy metals ionic compound such as Tin, Lead, Mercury, Antimony, Bismuth, Arsenic etc., and Organometallic-salts etc., which will cause the gel incomplete curving even will be non-curved.
TYPICAL APPLICATION
/ Automotive electronics
/ Telecommunication hardware
/ Computer and peripherals
/ 5G base station & infrastructure
/ Between any heat-generating component and a heat sink
/ EV electric vehicle
TYPICAL PROPERTIES
| PROPERTY | TPS586 | UNIT | TEST METHOD |
|---|---|---|---|
| Color | White-A Gray-B | - | Visual |
| Resin Base | Silicone | - | - |
| A:B | 100:100 | - | - |
| Viscosity | 5.7 | Pa.s | ISO 3219 |
| Density | 2.3 | g/cm³ | ASTM D792 |
| Application temperature | -60~180 | °C | - |
| Hardness | 10 | Shore A | ASTM D2240 |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 1.5 | W/m·K | ASTM D5470 |
| Dielectric breakdown | 14 | KV/mm | ASTM D149 |
| Volume resistivity | >10¹² | Ohm-m | ASTM D257 |
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