RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000
TT3000
6.0 W/m*K
Nano Thermal Grease
Thermal paste plays a crucial role in computer cooling. When processors (CPUs) or graphics cards (GPUs) operate continuously, they generate a significant amount of heat. If cooling performance is insufficient, it not only affects the overall performance of the computer but may also lead to system instability or crashes due to overheating.

CATEGORY

FEATURES

/ Thermal conductivity:6.0 W/m*K
/ Excellent thermal conductivity
/ Stable and homogeneous compound to ensure thermal performance
/ Formula can fill the gap at low pressure
/ High stability and reliability
/ Solvent-free formula
/ The product is qualified for ROHS and REACH

CONFIGURATIONS

/ Tinplate Can: 1kg
/ Other special and custom sizes are available upon request

TYPICAL APPLICATION

/ CPU and chip coolers
/ Switching power supplies
/ Between any heat-generating component and heat Sink
/ 5G base station & infrastructure
/ EV electric vehicle

TYPICAL PROPERTIES

PROPERTY TT3000 UNIT TEST METHOD
Color White - Visual
Resin base Silicone - -
Filler Non-Metal - -
Viscosity 300 Pa.s ISO 3219
Density 3.3 g/cm³ ASTM D792
Application temperature -60~180 °C -
Bond line thickness 10 μm -
ROHS & REACH Compliant - -
THERMAL
Thermal conductivity 6.0 W/m*K ASTM D5470
Thermal impedance@50psi 0.007 °C-in²/ W ASTM D5470
Thermal impedance@50psi 5.0 °C-mm²/ W ASTM D5470

Related​ Product

TT3000
6.0 W/m*K
Nano Thermal Grease

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    熱介面管理專家

    LiPOLY® Advance TIMs

    桃園市八德區永豐路435號

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