G3380T
6.0 W/m*K
Low minimum bond line
液態
墊片
吸波
膠帶
輕量
絕緣
石墨
斷熱
矽型 · 導熱材料 ——
TT3000
6.0 W/m*K
Nano Thermal Grease
導熱膏在電腦散熱領域中扮演著至關重要的角色。當處理器（CPU）或顯示卡（GPU）持續運作時，都會產生大量熱能。如果散熱效能不足，不僅會影響電腦整體性能，還可能導致系統過熱而出現不穩定或當機現象。
TT3000 導熱膏具有極低熱阻和良好的導熱性，已廣泛用於消費電子產品和微處理器的熱控制技術，當組件的溫度升高，潤滑脂的粘性會降低，可以潤濕界面元件，熱傳導係數： 6.0W/m*K 的間隙填充材料。
CATEGORY
FEATURES
/ Thermal conductivity:6.0 W/m*K
/ Excellent thermal conductivity
/ Stable and homogeneous compound to ensure thermal performance
/ Formula can fill the gap at low pressure
/ High stability and reliability
/ Solvent-free formula
/ The product is qualified for ROHS and REACH
CONFIGURATIONS
/ Tinplate Can: 1kg
/ Other special and custom sizes are available upon request
TYPICAL APPLICATION
/ CPU and chip coolers
/ Switching power supplies
/ Between any heat-generating component and heat Sink
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL PROPERTIES
| PROPERTY | TT3000 | TEST METHOD | UNIT |
|---|---|---|---|
| Color | White | Visual | - |
| Resin base | Silicone | - | - |
| Filler | Non-Metal | - | - |
| Viscosity | 300 | ISO 3219 | Pa.s |
| Density | 3.3 | ASTM D792 | g/cm³ |
| Application temperature | -60~180 | - | °C |
| Bond line thickness | 10 | - | μm |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 6.0 | ASTM D5470 | W/m*K |
| Thermal impedance@50psi | 0.007 | ASTM D5470 | °C-in²/ W |
| Thermal impedance@50psi | 5.0 | ASTM D5470 | °C-mm²/ W |
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