RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000
G3380T
6.0 W/m*K
Low minimum bond line
After applying thermal paste to the surface of the CPU, it effectively eliminates excess air between the processor and the heatsink, enabling high-performance thermal conductivity. This allows the heat generated by the CPU to be transferred to the heatsink more quickly, thereby improving the overall cooling performance of the computer.

CATEGORY

FEATURES

/ Thermal conductivity: 6.0 W/m*K
/ Low thermal impedance
/ Can be applied manually dispensed or screen printed
/ Low minimum bond line

CONFIGURATIONS

/ Tinplate Can: 1kg
/ Other special and custom sizes are available upon request

TYPICAL APPLICATION

/ LED appliance
/ EV electric vehicle
/ CPU and chip coolers
/ Switching power supplies
/ 5G base station & infrastructure
/ Between any heat-generating component and heat sink

TYPICAL PROPERTIES

PROPERTY G3380T UNIT TEST METHOD
Color Gray - Visual
Resin base Silicone - -
Filler Non-Metal - -
Viscosity 181 Pa.s ISO 3219
Density 2.7 g/cm³ ASTM D792
Application temperature -60~180 °C -
Bond line thickness 30 µm -
ROHS & REACH Compliant - -
THERMAL
Thermal conductivity 6.0 W/m*K ASTM D5470
Thermal impedance@50psi 0.01 °C-in²/ W ASTM D5470
Thermal impedance@50psi 6.4 °C-mm²/ W ASTM D5470

Related​ Product

G3380T
6.0 W/m*K
Low minimum bond line

Contact Us


    熱介面管理專家

    LiPOLY® Advance TIMs

    桃園市八德區永豐路435號

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